Liquid glue encapsulation device and encapsulation method using same

A packaging method and a technology of liquid glue, which is applied to the device and coating of the surface coating liquid, can solve the problems of poor dispensing accuracy and achieve the effect of increasing the dispensing speed and improving the dispensing accuracy

Inactive Publication Date: 2010-03-17
SHENZHEN REFOND OPTOELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this dispensing method can improve the dispensing speed of the syringe 94 by increasing the number of needles 95 or increasing the number of controllers, etc., although the speed has increased, this

Method used

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  • Liquid glue encapsulation device and encapsulation method using same
  • Liquid glue encapsulation device and encapsulation method using same
  • Liquid glue encapsulation device and encapsulation method using same

Examples

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Embodiment Construction

[0021] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0022] refer to image 3 and Figure 4 As shown, a liquid glue packaging device provided by the embodiment of the present invention includes a thin sheet 2 that fits with the product 1 of the liquid glue to be packaged, and the thin sheet 2 is provided with the liquid glue to be packaged with the product 1. The parts 11 correspond to and have equal numbers of injection holes 21 .

[0023] Preferably, the thin sheet 2 can be metal sheet, plastic sheet, glass sheet or other materials.

[0024] Preferably, the injection hole 21 can be cylindrical (such as Figure 4 shown), frustum (such as Figur...

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PUM

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Abstract

The invention is applicable to the field of liquid glue encapsulation, and provides a liquid glue encapsulation device which comprises a slice jointed with the product to be encapsulated with liquid glue, and the slice is provided with glue injecting holes that are corresponding to the parts of the product to be encapsulated with liquid glue and have the number being the same as that of the parts.The invention also provides an encapsulation method using the liquid glue encapsulation device, comprising: the slice provided with the glue injecting holes is jointed on the product to be encapsulated with the liquid glue, and the liquid glue is brushed towards the glue injecting holes by a brush or a scraper, so that liquid glue flows into the glue injecting holes and then onto the parts of theproduct to be encapsulated with liquid glue, and the parts of the product to be encapsulated with liquid glue are fully filled with the liquid glue; therefore, the speed and the accuracy rate of adhesive dispense can be improved.

Description

technical field [0001] The invention belongs to the field of liquid glue packaging, and in particular relates to a liquid glue packaging device and a packaging method using the device. Background technique [0002] At present, the existing liquid glue packaging devices dispens glue point by point by moving the syringe or the workbench under the syringe, and the dispensing head connected with the syringe generally includes a screw type or a spray head type. [0003] Such as figure 1 and figure 2 As shown, in the prior art, the specific implementation of point-by-point dispensing by moving the syringe is as follows: a splint 92 is set above a workbench 91, and the splint 92 fixes the product 93 to be dispensed on the workbench 91, A syringe 94 equipped with glue is arranged above the product 93, and by moving the syringe 94, the glue in the syringe 94 is delivered to the liquid glue position 931 to be packaged of the product 93 through the needle 95. Although this dispensi...

Claims

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Application Information

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IPC IPC(8): B05D1/32
Inventor 龚伟斌胡建华
Owner SHENZHEN REFOND OPTOELECTRONICS
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