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Double-adhesive-dispensing structure of LED die bonder

An LED die-bonding machine and glue dispensing technology, which is applied to devices and coatings that apply liquid to the surface, can solve problems such as affecting the working efficiency of die-bonding, improve dispensing efficiency, reduce production costs, and simplify dispensing. effect of the process

Active Publication Date: 2017-10-20
SHENZHEN XINYICHANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional single-dispensing mechanism can only dispense one glue point at a time. When bonding large crystals, two or more dispensing actions must be done to complete the required glue point dispensing, and then solidify the crystal. This seriously affects the actual die bonding efficiency

Method used

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  • Double-adhesive-dispensing structure of LED die bonder

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Embodiment Construction

[0036] The preferred embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, so that the advantages and features of the present invention can be more easily understood by those skilled in the art, so as to define the protection scope of the present invention more clearly.

[0037] Please refer to attached Figure 1-7, a double glue dispensing structure of an LED crystal bonder according to the present invention, the double glue dispensing structure is arranged on a platen 1, a U-shaped notch is arranged on one long side of the platen 1, and two sides of the U-shaped notch There are two square mounting holes on the side, and the double dispensing structure includes a longitudinal drive assembly 2, a first vertical drive assembly 3 and a second vertical drive assembly 4 arranged on both sides of the longitudinal drive assembly 2, the The longitudinal drive assembly 2 is installed at the U-shaped notch, the first verti...

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PUM

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Abstract

The invention discloses a double-adhesive-dispensing structure of an LED die bonder. The double-adhesive-dispensing structure of the LED die bonder comprises a table plate; the table plate is provided with a longitudinal driving assembly, and the two sides of the longitudinal driving assembly are provided with a first vertical driving assembly and a second vertical driving assembly correspondingly; and the longitudinal driving assembly is in rigid connection with the first vertical driving assembly and the second vertical driving assembly, and the longitudinal driving assembly is fixedly provided with a first adhesive dispensing manipulator and a second adhesive dispensing manipulator. The longitudinal driving assembly controls the first adhesive dispensing manipulator and the second adhesive dispensing manipulator to move forwards and backwards at the same time; and the first vertical driving assembly and the second vertical driving assembly control the first adhesive dispensing manipulator and the second adhesive dispensing manipulator to move up and down correspondingly. When the double-adhesive-dispensing structure need to perform adhesive dispensing operation on large crystals many times, the adhesive dispensing process can be effectively simplified, and the work efficiency is improved. Besides, the double-adhesive-dispensing structure of the LED die bonder is simple in structure, small in occupied space and low in cost.

Description

technical field [0001] The invention relates to the technical field of LED processing, in particular to a double dispensing structure of an LED crystal bonder. Background technique [0002] A light emitting diode (Light Emitting Diode, LED) is a light emitting element that can convert electrical energy into light energy. With the continuous maturity of LED technology, the improvement of people's awareness of environmental protection and the strong support of the country, LED products are more and more used in lighting, display and other fields due to their advantages of energy saving, environmental protection and long life. For lighting, due to the increasing requirement for brightness, the use of large-grained crystals has become the mainstream direction in recent years. [0003] LED crystal bonding machine is a device that uses glue to bond and fix the crystal on the bracket. It is equipped with a dispensing robot and a crystal robot to alternately perform glue dispensing...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B05C5/02B05C11/10
CPCB05C5/02B05C11/1044
Inventor 胡新荣梁志宏胡新平陈玮麟
Owner SHENZHEN XINYICHANG TECH CO LTD
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