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Condensing recovery device and process device provided with same

A technology for condensation recovery and process equipment, applied in lighting and heating equipment, steam/steam condensers, photosensitive material processing, etc., can solve problems such as endangering the safety of workers, damage to parts, easy steam leakage, etc., to improve recovery efficiency , the effect of improving efficiency

Inactive Publication Date: 2011-09-07
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this will cause the chambers 110, 120 to be filled with a large amount of steam, so that the parts in the chambers 110, 120 are easily affected by the steam and are damaged, and the steam in the chambers 110, 120 is easy to leak out, endangering the safety of workers. Safety

Method used

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  • Condensing recovery device and process device provided with same
  • Condensing recovery device and process device provided with same
  • Condensing recovery device and process device provided with same

Examples

Experimental program
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Embodiment Construction

[0066] figure 2 It is a schematic diagram of a process equipment with a condensation recovery device according to an embodiment of the present invention. Please refer to figure 2 , the process equipment 200 with a condensation recovery device in this embodiment may be a photoresist removal equipment, but not limited thereto. The process equipment 200 includes at least one chamber (a plurality of chambers 210 , 220 , 230 are taken as an example in this embodiment), a liquid medicine recovery pipeline 240 and a condensation recovery device 300 . The chambers 210, 220, 230 are suitable for accommodating liquid medicine vapor, the liquid medicine recovery pipeline 240 is at least connected to some of the chambers (for example, connected to the chambers 210, 220), and the condensation recovery device 300 is arranged on the liquid medicine recovery pipeline 240 on the trail.

[0067] The aforementioned process equipment 200 may further include at least one liquid recovery tank ...

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PUM

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Abstract

The invention provides a condensing recovery device which comprises a first pipe body and a condensing pipe, wherein the condensing pipe is arranged in the first pipe body; the first pipe body is provided with an air inlet end and an air outlet end, and a pipe wall of the first pipe body is provided with a first opening, a second opening and a liquid recovery hole; a coolant input end and a coolant output end of the condensing pipe respectively penetrate out of the first pipe body through the first opening and the second opening; the condensing pipe is spirally bent to the position adjacent to the second opening from the position adjacent to the first opening in the first pipe body so as to form a spiral condensing part; the internal diameter of the spiral condensing part changes along the preset direction, and the preset direction points at the second opening from the first opening. The condensing recovery device has better recovery efficiency. Besides, the invention also provides a process device which is provided with the condensing recovery device.

Description

technical field [0001] The present invention relates to a recovery device, and in particular to a condensation recovery device and process equipment with the condensation recovery device. Background technique [0002] In the semiconductor process or the wet etching process of the liquid crystal display panel, the process equipment often used is photoresist removal equipment. figure 1 It is a schematic diagram of an existing photoresist removal equipment. Please refer to figure 1 , the existing photoresist removal equipment 100 includes three chambers 110 , 120 , 130 and a chemical solution recovery pipeline 140 , wherein the chemical solution recovery pipeline 140 is connected to the chambers 110 , 120 . [0003] The temperature in the chambers 110 and 120 is high temperature (about 80 degrees Celsius), while the temperature in the chamber 130 is normal temperature. The substrate 50 to be stripped of photoresist will be sent to the chamber 110, chamber 120 and chamber 130...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): F28B1/00F28B9/08G03F7/42
Inventor 陈信全林士能
Owner AU OPTRONICS CORP