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Substrate polishing apparatus and method of polishing substrate using the same

A technology for substrates and equipment, which can be used in cleaning methods using liquids, grinding/polishing equipment, cleaning methods using tools, etc., and can solve problems affecting device characteristics and yield of finished products.

Active Publication Date: 2010-06-23
SEMES CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, contaminants such as particles, organic pollutants, and metal impurities remaining on the substrate surface can significantly affect device characteristics and finished product yield

Method used

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  • Substrate polishing apparatus and method of polishing substrate using the same
  • Substrate polishing apparatus and method of polishing substrate using the same
  • Substrate polishing apparatus and method of polishing substrate using the same

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Embodiment Construction

[0030] Preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art. For example, although a wafer is used as a semiconductor substrate, the scope and spirit of the present invention are not limited thereto.

[0031] figure 1 is a schematic diagram of a single wafer type polishing system according to an embodiment of the present invention; figure 2 is showing figure 1 Side sectional view of a single-wafer type polishing system.

[0032] refer to figure 1 with figure 2 , the substrate processing system 2000 may include a loading / unloading unit 10 , an index robot 20 , a buffer unit 30 , a main t...

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Abstract

Provided are a substrate polishing apparatus and a method of polishing a substrate using the same. The substrate polishing apparatus includes a substrate supporting member, a polishing unit, and a control unit. The substrate is seated on the rotatable substrate supporting member. The polishing unit includes a rotatable and swingable polishing pad to polish a top surface of the substrate. The control unit controls the substrate supporting member and the polishing unit during a polishing process to adjust a value of a polishing variable adjusting a polishing amount of the substrate according to a horizontal position of the polishing pad with respect to the substrate. Therefore, the substrate polishing apparatus may locally adjust the polishing amount of the substrate to improve polishing uniformity and product yield.

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Korean Patent Application No. 10-2008-0119920 filed on Nov. 28, 2008, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to an apparatus and method for manufacturing a semiconductor, and more particularly, to a substrate processing apparatus and method for polishing and cleaning a semiconductor substrate in a single wafer processing manner. Background technique [0004] In a general semiconductor device manufacturing process, multiple unit processes, such as deposition process, photolithography process, and etching process, should be repeated to form and stack thin films. These processes are repeated until a desired predetermined circuit pattern is formed on the wafer. After the circuit pattern is formed, the surface of the wafer is uneven. Since semiconductor devices are highly integrated and also have a mult...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24B29/00B24B49/00H01L21/302B08B3/02B08B1/04B24B37/00B24B37/005H01L21/304
CPCB24B41/047B24B49/16B24B37/042H01L21/304
Inventor 金性洙吴世勋
Owner SEMES CO LTD