Packing baseplate for LED light source

An LED light source and packaging substrate technology, applied in electrical components, circuits, semiconductor devices, etc., can solve problems such as light decay, and achieve the effects of reducing light pollution, improving light efficiency utilization, and increasing heat conduction area.
CN101764191AInactive Publication Date: 2010-06-30吴锏国
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Patent Information

Authority / Receiving Office
CN Β· China
Current Assignee / Owner
吴锏国
Publication Date
2010-06-30
Estimated Expiration
Not applicable Β· inactive patent

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Abstract

The present invention relates to a packing baseplate for an LED light source. The packing baseplate comprises a packing soleplate, a hollow packing box and heat conducting electrodes, wherein the heat conducting electrodes are installed on the upper base face of the packing box, the lower base face of the packing box is placed on the packing soleplate, and packing soleplate inside the packing box is provided with a protrusion. A wafer is fixed on the protrusion so that the wafer fixing surface is higher than the packing box, thereby solving the problem that effective light of 30% of peripheral lighting angles is shaded because the wafer fixing surface is lower than the packing box in the existing recessed packing with a flat plate. The back of the packing soleplate is provided with a chamber corresponding to the front protrusion, which is convenient for filling heat conducting materials and guarantees the tight joint between the back of the packing soleplate and a radiator for better heat conduction.
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Description

technical field

[0001] The invention relates to a package substrate of an LED light source. Background technique

[0002] High-power LED lighting has the advantages of low energy consumption, long service life, no pollution, and no radiant heat. It is a typical low-carbon economic industry, representing the fourth-generation lighting source revolution, and is an inevitable trend to replace traditional lighting fixtures. At present, its realization There are two ways:

[0003] One is that a single high-power LED chip is individually packaged as a single light source, and multiple high-power LED single light sources are combined to form a light source suitable for lighting requirements. This combination of lighting sources is easy to solve heat dissipation, and the lumen value of a single chip package is high, but the visual effect is poor, and the shadows on the road overlap, which is easy to cause visual fatigue or dizziness, and there are many lamp circuit ports, the syste...

Claims

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