Dicing/die bonding tape and method for manufacturing semiconductor chip
A chip bonding, semiconductor technology, applied in the direction of semiconductor/solid device manufacturing, semiconductor devices, film/sheet adhesives, etc., can solve problems such as reducing the adhesive force of the adhesive layer
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Embodiment 1～11 and comparative example 1～5
[0195] To prepare the non-adhesive layer, any one of acrylic polymers 1 to 5 shown in Table 1 below was used. A non-adhesive layer was formed from a composition containing any one of acrylic polymers 1 to 5 as a main component.
[0196] First, the following acrylic polymers were synthesized.
[0197] (acrylic polymer 1)
[0198] 95 parts by weight of 2-ethylhexyl acrylate, 5 parts by weight of 2-hydroxyethyl acrylate, 0.2 parts by weight of Irgacure 651 (manufactured by Ciba-Geigy, 50% ethyl acetate solution) as a photoradical generator, and 0.01 Parts by weight of dodecylmercaptan were dissolved in ethyl acetate to obtain a solution. The solution was irradiated with ultraviolet rays to perform polymerization, and an ethyl acetate solution of the polymer was obtained. And, 3.5 parts by weight of 2-methacryloyloxyethyl isocyanate (manufactured by Showa Denko, Karenz MOI) was reacted with respect to 100 parts by weight of the solid content of the solution to obtain an acrylic...
Embodiment 1
[0223] A composition was obtained by mixing 100 parts by weight of the above-mentioned acrylic polymer 1, 1 part by weight of Irgacure 651, and 15 parts by weight of U324A which is a urethane acrylic oligomer. The resulting composition was irradiated with 4000mJ / cm2 using two 160W mercury lamps 2 The energetic light cures the composition, resulting in a non-adhesive film as a non-adhesive layer. The storage modulus and elongation at break of the non-adhesive layer thus obtained were measured at 23° C., which is the temperature at which the semiconductor chip is picked up, by the following methods.
[0224] 1) Measurement of storage modulus: A fully cured non-adhesive layer with a thickness of 0.5 mm and a width of 5 mm was cut into a width of 3 cm to obtain a test sample. The storage elastic modulus of the test sample at 23° C. was determined using DVA-200 manufactured by IT (イテイ) Measurement Co., Ltd. under the conditions of 10 Hz and a strain of 0.1%.
[0225] 2) Elongat...
Embodiment 2～11 and comparative example 1～5
[0230] As shown in the following Tables 2 and 3, a non-adhesive layer was obtained in the same manner as in Example 1 except that the types and compounding ratios of the materials of the composition for forming the non-adhesive layer were changed.
[0231] (Evaluation)
[0232] The storage modulus and elongation at break of the non-adhesive layer at 23° C. were measured as described above, and the results are shown in Tables 2 and 3 below.
[0233] The peel force between the non-adhesive layer and the adhesive layer of the obtained dicing and die-bonding tape was measured in the following manner. The results are shown in Tables 2 and 3 below.
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