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Processing device

A technology of processing device and heating device, applied in ion implantation plating, coating, instrument and other directions, can solve the problems of inconvenience, inconvenience, size, weight cannot be transported, vacuum chamber manufacturing cost increases, etc., and achieve good results.

Active Publication Date: 2014-04-02
ULVAC INC
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, a large-scale vacuum chamber is manufactured by cutting from a large aluminum block, and a dedicated large-scale cutting processing device is required, and the manufacturing cost of the vacuum chamber itself becomes high.
[0004] In addition, a large vacuum chamber is inconvenient because it requires a large trailer or other transportation device. In addition, it cannot be transported due to legal restrictions on its size and weight.

Method used

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Embodiment Construction

[0029] figure 1 It is a sectional view of the processing apparatus of Embodiment 1, figure 2 is a schematic perspective view showing the cavity body structure, image 3 is a schematic diagram showing the structure of the chamber body constituting the vacuum chamber, Figure 4 is a schematic top view of the treatment space.

[0030] The processing apparatus (heat processing apparatus) 10 of this embodiment heat-processes two substrates S in one processing space A. As shown in FIG. Such as figure 1 As shown, the heat treatment apparatus 10 includes: a vacuum chamber 20 having a processing space A for heat processing two substrates S; a support member 30 supporting each substrate S in the processing space A; and simultaneously heating the substrate S The heating device 40. In addition, this heat treatment apparatus 10 can also be used, for example, when performing a degassing process by heat-processing the substrate S. As shown in FIG.

[0031] The vacuum chamber 20 includ...

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Abstract

The invention provides a processing device with features of convenient transportation and a more compact vacuum cavity. The processing device comprises a vacuum cavity, wherein the vacuum cavity comprises a cavity main body (21) composed of a plurality of block cavity parts (25) with perforation holes (24) being inserted by substrates and grooves (27) are continuously arranged along the whole circle of an opening part of the perforation hole of another bunt surface on at least one adjacent cavity part and the cavity parts are fixed when sealing parts (26) clamped and mounted in the grooves are respectively at close set state and the cavity main body (21) comprises a processing space (A) composed of perforation holes (24); an opening wall part (22) for sealing the processing space; a cover part (23) switchably plugged into another opening of the processing space; a heating device for heating the substrate using the irradiation heat in each processing space and a pair of substrate support parts (30) respectively arranged above and below the heating device and for supporting the substrate (S) opposite to the heating device.

Description

technical field [0001] The invention relates to processing devices. Background technique [0002] In recent years, liquid crystal displays have been increasing in size, and as a processing substrate, for example, an eleventh-generation (3000 mm×3320 mm) size glass substrate has been used. Various processing apparatuses, such as a sputtering apparatus which performs the film-forming process of the metal film for wiring, and a heat treatment apparatus which performs heat treatment, are used in manufacture of this liquid crystal display. These processing apparatuses have vacuum chambers for carrying out predetermined processes. [0003] With the increase in size of the processing substrate, it is necessary to increase the size of the vacuum chamber itself of the processing apparatus so that a film forming process and the like can be performed over the entire surface of the processing substrate in one go. In this case, a large-scale vacuum chamber is manufactured by cutting fr...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C03C17/06C03C17/09
CPCC23C14/00G02F1/13
Inventor 池田均菊池正志小川正浩冈山智彦
Owner ULVAC INC