Unlock instant, AI-driven research and patent intelligence for your innovation.

Multilayer compound floor with aluminum structure and preparation method thereof

A multi-layer composite and flooring technology, applied in chemical instruments and methods, lamination, lamination devices, etc., can solve the problems of low heat utilization rate, poor thermal conductivity, warping, etc., and achieve fast heat conduction and strong stability , the effect of not easy to deform

Inactive Publication Date: 2010-07-28
吴殿满
View PDF4 Cites 4 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0014] Whether it is the base material, equipment required for production, or the processed floor, there is a lot of tradition, universality and randomness. If the above method is used to produce large-scale floors, the problem of warping is serious.
At the same time, due to the fact that the ordinary composite floor is made of all wood, its thermal conductivity is poor. For users in northern regions who use geothermal pipes for heating in winter, the heat utilization rate is low.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Multilayer compound floor with aluminum structure and preparation method thereof
  • Multilayer compound floor with aluminum structure and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0045] The composite floor of the present invention is composed of an upper board 1, an upper veneer 2, an upper aluminum board 3, a substrate board 4, a lower aluminum board 5, a lower board 6 and a back board 7, the upper board 1, the upper board 2, the base board The board 4, the lower table board 6 and the back board 7 are wooden boards, and the layers of boards are arranged in sequence and bonded with glue. The thickness of the upper board 1 is 3.3-6.3 mm, and it is placed vertically. The thickness of the upper board 2 is 0.8-6.3 mm. 1.2mm, placed horizontally, the thickness of the upper aluminum plate 3 is 0.25-0.35mm, the thickness of the base plate 4 is 3.3-6.3mm, placed horizontally, the thickness of the lower aluminum plate 5 is 0.25-0.35mm, and the thickness of the lower table plate 6 is 0.8- 1.2mm, placed horizontally, and the thickness of the backboard 7 is 3.3-6.3mm, placed vertically.

[0046] The preparation method of above-mentioned compound floor is to compri...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a multilayer compound floor with an aluminum structure and a preparation method thereof, which relate to the technical field of floor processing. The multilayer compound floor is prepared by sequentially overlapping, arraying and gluing an upper surface plate, an upper single plate, an upper aluminum plate, a substrate plate, a lower aluminum plate, a lower surface plate and a back plate. The floor has the advantages of strong stability, smoother, insusceptible deformation, quicker heat transfer, more uniform and particular suitability for terrestrial heat pavement.

Description

Technical field: [0001] The invention relates to the technical field of floor processing, specifically the invention relates to a composite floor, and the invention also relates to a preparation method of the composite floor. Background technique: [0002] The basic structure of ordinary composite flooring is: surface board, glued board, bottom board, glued together. The production process is as follows: after the selected substrates are glued, they are pressed together by ordinary hot pressing equipment, and after sanding, they are processed into semi-finished plates of normal specifications by ordinary tenoning equipment, and then further processed according to different requirements. [0003] 1. Selection of ordinary composite floor substrates: [0004] ①.Table board: length 400-2300MM; width: 80-270MM; thickness 3.0-4.0MM [0005] ②. Glue-coated board and bottom board: The material is selected according to the selected specifications of the board and the processing lim...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): E04F15/02B32B15/10B32B37/10B32B37/12
Inventor 吴殿满李春平
Owner 吴殿满