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Communication device and method for manufacturing circuit board of communication device

A manufacturing method and technology of communication equipment, applied in printed circuit manufacturing, circuit substrate materials, printed circuits, etc., can solve problems affecting connector assembly, etc., and achieve the effect of simple operation

Active Publication Date: 2011-07-06
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Since the connector pins have a certain length, it is required that the resin flow glue of the bonding sheet should not flow into the hole, but due to the limitation of the manufacturing process, it is inevitable that the resin flow glue will flow into these holes. If the resin flow If too much glue flows into the hole, exceeding the specified allowable height, the height of the connector pin inserted into the hole will be raised by the resin flow glue that flows into the hole and cured, which will cause the connector pin to be in contact with the hole. Pin interference, affecting the assembly of the connector

Method used

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  • Communication device and method for manufacturing circuit board of communication device
  • Communication device and method for manufacturing circuit board of communication device
  • Communication device and method for manufacturing circuit board of communication device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0017] Such as figure 1 As shown, one embodiment of the present invention provides a method for manufacturing a circuit board of a communication device, including the following steps:

[0018] a) Make a sub-board 1, form a through hole 11 and a pressure-facing surface 12 on the sub-board 1 (a pressure-facing surface refers to a surface that is used to butt and press the adhesive to connect multiple sub-boards together); The board 1 is composed of at least one inner core board, wherein, in the case of a sub-board with multiple inner core boards, the multiple inner core boards are pressed together, and a dielectric layer is filled between adjacent inner core boards, A graphic layer may be further included on the outside of the plurality of inner core boards, and a dielectric layer is filled between the graphic layer and the inner core boards;

[0019] b) Arranging a barrier layer 2 on the pressing surface 12 of the sub-board 1 with a through hole 11, the barrier layer 2 can be ...

Embodiment approach 2

[0025] Such as image 3 As shown, the specific manufacturing steps of PCB include:

[0026] a) making a sub-board 1, forming a through hole 11 and a pressing surface 12 on the sub-board 1;

[0027] b) A barrier layer 2 is provided on the pressing surface 12 of the sub-board 1 with a through hole 11, the barrier layer 2 can be arranged on the entire pressing surface 12 or the barrier layer 2 only covers the through hole 11 of the sub-board 11 Orifice position. In this embodiment, the barrier layer 2 is a resin layer. The step of setting the barrier layer 2 is to paint a layer of fluid state on the entire pressure-facing surface 12 of the sub-board 1 or at the orifice position of the through hole 11. The resin layer 23, and then the resin layer 23 is cured to form the barrier layer 2, so that the barrier layer 2 is bonded to the pressing surface 12 of the sub-board 1;

[0028] c) An adhesive sheet 3 is set between the barrier layers 2 of the two sub-boards 1 covered with the b...

Embodiment approach 3

[0033] Such as Figure 4 As shown, the specific manufacturing steps of PCB include:

[0034] a) making a sub-board 1, forming a through hole 11 and a pressing surface 12 on the sub-board 1;

[0035] b) A barrier layer 2 is provided on the pressing surface 12 of the sub-board 1 with a through hole 11, the barrier layer 2 can be arranged on the entire pressing surface 12 or the barrier layer 2 only covers the through hole 11 of the sub-board 11 The position of the hole. In this embodiment, the barrier layer 2 includes a bonding sheet 24 and a metal foil 25. The step of setting the barrier layer 2 includes the entire pressure-facing surface 12 of the sub-board 1 or the hole of the through hole 11. A layer of bonding sheet 24 and metal foil 25 are pressed together, and the bonding sheet 24 is positioned between the metal foil 25 and the pressing surface 12. The metal foil 25 can include copper foil, or silver foil, or gold foil, to be After the adhesive sheet 24 is solidified an...

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Abstract

The invention relates to a method for manufacturing a circuit board of a communication device, which comprises the following steps: (a) arranging a barrier layer on a compressing surface of each daughter board with a through hole; and (b) carrying out lamination by using a bonding sheet as a binding between the daughter boards provided with the barrier layers. The embodiment of the invention alsodiscloses the communication device, which comprises at least one circuit board, wherein the circuit board comprises more than two daughter boards with the through holes; each daughter board is provided with the compressing surface; the compressing surfaces of the two daughter boards are laminated by using the bong sheet; the compressing surfaces of the two daughter boards are respectively provided with the barrier layer; and the barrier layers on the two daughter boards are respectively combined with the two sides of the bonding sheet. The communication device and the method for manufacturingthe circuit board of the communication device, which are provided by the embodiment of the invention, can effectively solve the problem that the resin gummosis enters the hole and has simple and convenient operation.

Description

technical field [0001] The invention relates to the technical field of electronic communication, in particular to a communication device and a method for manufacturing a circuit board thereof. Background technique [0002] A circuit board (PCB: Printed Circuit Board) usually includes multiple sub-boards, and bonding sheets are used between multiple sub-boards [PP: Prepreg is a resin in a semi-cured state (called B-Stage), and the bonding sheet can also be called a prepreg] Press bond. There will be some buried holes, blind holes and through holes formed on the PCB. The through holes run through the top and bottom of the PCB, which can be seen from the appearance of the PCB. There is a difference between buried vias and vias. A buried hole refers to a hole buried inside the PCB. Both ends of the hole are closed and cannot be seen from the appearance of the PCB. A blind hole refers to a hole with one end opened on the surface of the PCB and the other end inside the PCB. A ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B32B37/12H05K3/00H05K1/03B32B7/12
Inventor 温怡芸李志海欧康华曹美汉范路平
Owner HUAWEI TECH CO LTD