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Laser processing apparatus and laser processing method

A laser processing and laser technology, which is applied in the direction of laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of inability to align the focus position, processing quality deterioration, etc., and achieve the effect of easy laser processing

Inactive Publication Date: 2010-10-06
MITSUBISHI ELECTRIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, if the focus tolerance (tolerance) of the laser beam emitted from the condenser lens is less than or equal to 30 μm, there is a problem that the focus position cannot be aligned and the processing quality will deteriorate.

Method used

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  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method
  • Laser processing apparatus and laser processing method

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Experimental program
Comparison scheme
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Embodiment approach

[0021] figure 1 It is a figure which shows the laser processing apparatus concerning embodiment of this invention. The laser processing apparatus 1 is an apparatus that performs laser processing while correcting the height of the focus position during processing so that the focus position of the laser light matches the unevenness of the XY table 35 . The laser processing apparatus 1 of the present embodiment calculates an approximate formula (model formula) obtained by modeling the height (surface height) of the XY table 35 using the heights measured at each position of the XY table 35, and uses This model adjusts the height of the laser irradiation position. The laser processing apparatus 1 is configured to include an fθ lens 31 , a height measurement sensor 32 , a camera 33 , a Z-axis drive unit 34 , and an XY table 35 .

[0022] The fθ lens (laser irradiation unit) 31 condenses laser light 30 emitted from a laser oscillator (not shown) and guided to the processing head si...

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Abstract

The invention provides a laser processing apparatus which easily performs laser processing to workpieces on an XY workbench. The laser processing apparatus irradiates laser to workpieces on the XY workbench and includes a laser illumination section which moves to a predetermined height on top of workpieces to irradiate laser to them; a Z-axle correction position calculating section (23) which uses an approximate expression which is achieved by modeling the surface height of the XY workbench to calculate the correction value of the height of the laser illumination section aiming at processing positions on workpieces, correcting the processing height indicated during workpiece processing by means of the corrected value and calculating the corrected processing height; and a Z-axle driving section (34) which moves the laser irradiation section to the corrected processing height.

Description

technical field [0001] The present invention relates to a laser processing device and a laser processing method for laser processing a workpiece placed on an XY table. Background technique [0002] A laser processing apparatus that irradiates a laser beam to a workpiece as a workpiece to perform laser processing on the workpiece is configured to include an XY table (processing table) on which the workpiece is placed. On the surface of the XY table, if there are irregularities of about 10 to 30 μm, for example, the focus position of the laser beam irradiated on the workpiece on the XY table will vary by about 10 to 30 μm depending on the position on the XY table. difference. In this case, if the focus tolerance of the laser light emitted from the condensing lens is less than or equal to 30 μm, there is a problem that the focus position cannot be aligned and the processing quality will deteriorate. [0003] In the laser processing machine described in Patent Document 1, the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/00B23K26/046
CPCB23K26/0853B23K26/032B23K37/0408G05B19/404
Inventor 金田充弘竹内昌裕
Owner MITSUBISHI ELECTRIC CORP