Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
A technology of a circuit substrate and a manufacturing method, which is applied in the directions of printed circuit manufacturing, circuit substrate materials, circuits, etc., can solve the problems of scorching of the substrate 100, inability to remove the insulating layer 102, cracks in the insulating layer 102, etc., and achieve the effect of preventing scorching
Inactive Publication Date: 2012-02-08
SEMICON COMPONENTS IND LLC
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Problems solved by technology
[0009] As a method of cutting this insulating layer 102, machining methods such as drilling processing have been used in the past, but due to the impact force generated by this machining method, problems such as cracks in other parts of the insulating layer 102 have occurred.
As a result, since the top surface of the substrate 100 is irradiated with the laser light 110, there is a problem that the top surface of the substrate 100 is burnt.
Moreover, there is also a problem that the insulating layer 102 cannot be removed even if the laser 110 is irradiated.
Method used
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Embodiment Construction
[0056] refer to figure 1 , the configuration of the hybrid integrated circuit device 10 to which this embodiment is applied will be described. figure 1 (A) is a perspective view of the hybrid integrated circuit device 10, figure 1 (B) is its cross-sectional view, figure 1 (C) is an enlarged cross-sectional view of the circuit board 26 .
[0057] In the hybrid integrated circuit device 10 , a hybrid integrated circuit composed of a conductive pattern 16 and circuit elements is assembled on the top surface of a substrate 12 , and leads 18 electrically connected to the circuit are led out to the outside. Furthermore, the hybrid integrated circuit formed on the top surface of the substrate 12, and the top surface, side surfaces, and bottom surface of the substrate 12 are integrally covered with a sealing resin 14 made of a thermosetting resin.
[0058]The substrate 12 is a substrate made of metal such as aluminum or copper, and its specific size is, for example, vertical x ...
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Abstract
Provided are a circuit board easy to process by laser and a manufacturing method thereof. The circuit board of the present invention includes a substrate (26), an insulating layer (20) covering an upper surface of the substrate (12), and a conductive pattern (16) of a predetermined shape formed on an upper surface of the insulating layer (20). The insulating layer (20) is made of a resin material (58) highly filled with a filler (56) made of silica. Further, a colorant made of an inorganic material is added to the resin material (58). Accordingly, when a laser is radiated onto the insulating layer (20) in order to perform cutting and removing processing, the insulating layer (20) is removed because the laser is absorbed by the colored resin material (58).
Description
technical field [0001] The present invention relates to a circuit substrate with a conductive pattern formed on the top surface of a substrate covered with an insulating layer and a manufacturing method thereof. Furthermore, the present invention relates to a circuit device having the circuit board configured as described above, a method of manufacturing the same, and a conductive foil with an insulating layer. Background technique [0002] Circuits that generate a lot of heat during operation, such as inverter circuits, need to be well dissipated to the outside. For example, refer to the following Patent Document 1, which discloses a circuit device that efficiently dissipates heat generated during operation of circuit elements to the outside. [0003] refer to Figure 9 , the configuration of the circuit device disclosed in the above document will be described. Here, an insulating layer 102 covering the top surface of the substrate 100 is formed on a substrate 100 made of...
Claims
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IPC IPC(8): H01L23/498H01L23/31H01L23/18H01L21/48H05K3/28B23K26/00H01L23/14H05K1/05H05K1/16H05K3/00
CPCH01L21/481H01L23/142H01L23/145H01L23/3107H01L23/3733H01L23/3735H01L24/48H01L24/73H01L2224/48227H01L2224/48247H01L2224/73265H01L2924/00014H01L2924/1203H01L2924/12041H01L2924/1304H01L2924/14H01L2924/181H01L2924/19041H01L2924/19043H01L2924/19105H01L2924/19107H01L2924/3025Y10T29/49124H01L2924/00H01L2924/00012H01L2224/45099H01L2224/45015H01L2924/207
Inventor 高草木贞道
Owner SEMICON COMPONENTS IND LLC