Unlock instant, AI-driven research and patent intelligence for your innovation.

Chip burn-in machine capable of realizing grouping test

A burn-in machine and group technology, applied in electronic circuit testing, semiconductor/solid-state device testing/measurement, etc., can solve the problems of time-consuming cost, production capacity, and unsatisfactory efficiency.

Active Publication Date: 2012-01-18
KING YUAN ELECTRONICS
View PDF0 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Accordingly, it is not only time consuming and costly, but also unsatisfactory in terms of production capacity and efficiency.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Chip burn-in machine capable of realizing grouping test
  • Chip burn-in machine capable of realizing grouping test
  • Chip burn-in machine capable of realizing grouping test

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0018] Please also see figure 1 , figure 2 ,and image 3 , figure 1 It is a schematic diagram of the overall equipment of a preferred embodiment of the chip burn-in machine that can be grouped and tested in the present invention, figure 2 It is a partially enlarged schematic diagram of a preferred embodiment of the present invention, image 3 It is a system architecture diagram of a preferred embodiment of the present invention. The figure shows a plurality of extension boards 21 , and each extension board 21 includes a microcontroller 211 , a memory 212 , and a test slot 213 (slot). Wherein, the microcontroller 211 on each extension board 21 is electrically coupled to the memory 212 and the test slot 213 on the same extension board 21 respectively. Moreover, the plurality of extension boards 21 includes at least one extension board G11 of a first group G1 and at least one extension board G21 of a second group G2 that have been grouped.

[0019] Furthermore, each burn-...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to a chip burn-in machine capable of realizing grouping test. A plurality of extension plates and a main control module are arranged in the machine, and each extension plate is provided with a microcontroller. The main control module transmits a first flag to part of extension plates, so as to designate the extension plates to be in a first group, or a second flag is transmitted to another part of the extension plates, so as to designate the extension plates to be in a second group, and the process is repeated. The main control module respectively captures a first group of parameters and a second group of parameters in a parameter database and respectively transmits the first group of parameters and the second group of parameters into the memory of each extension plate in the first group and the second group. The microcontroller on each extension plate can carry out burn-in test on a plurality of chips on the corresponding inserted burn-in plate according to the stored parameter respectively.

Description

technical field [0001] The invention relates to a chip burn-in machine capable of group testing, in particular to a burn-in test device for semiconductor integrated circuit chips. Background technique [0002] Some electronic components or chip packages, such as integrated circuits, are often installed in the form of miniaturized electronic components in a circuit composed of several master-slave circuit components to form a continuous and complete circuit function. Wherein, in order to ensure the reliability of the integrated circuit module in use, a burn-in test must be carried out before it is installed or used. That is to say, long-term high-temperature operation of the integrated circuit module can accelerate the failure of the defective integrated circuit module as soon as possible, so that the defective integrated circuit module can be screened out and eliminated. This is called burn-in. -in) test. [0003] However, the current general chip burn-in machines are deve...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/66G01R31/28
Inventor 杨世礼陈福泰
Owner KING YUAN ELECTRONICS