Flexible printed circuit board

一种布线电路基板、导体线路的技术，应用在印刷电路、印刷电路、印刷电路零部件等方向，能够解决FPC基板挠性下降等问题

Active Publication Date: 2010-11-03
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, compared with the FPC substrate without the conductive layer, the flexibility of the FPC substrate in the above publication is reduced.

Method used

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  • Flexible printed circuit board
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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] Next, a flexible printed circuit (hereinafter referred to as FPC) substrate according to one embodiment of the present invention will be described with reference to the drawings. The FPC board of this embodiment can be used for information communication equipment, such as a mobile phone, for example. In the following description, an example in which the FPC board of this embodiment is used in a mobile phone will be described, and the FPC board will be described in detail.

[0026] (1) Outline description of mobile phone

[0027] figure 1 It is a schematic plan view showing a general structure of a mobile phone having an FPC board according to an embodiment of the present invention. A mobile phone 1 includes a lower case 2 , an upper case 3 and a hinge 4 . The lower case 2 and the upper case 3 are foldably connected by a hinge portion 4 .

[0028] The lower case 2 has a central processing unit (hereinafter referred to as CPU) 21 inside. Signals and the like from u...

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PUM

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Abstract

The invention provides a flexible printed circuit board. An FPC board includes a base insulating layer. A plurality of wiring traces are formed on the base insulating layer. The adjacent wiring traces are arranged at a distance d from each other, and each wiring trace has a predetermined width and a thickness t1. Each transmission line pair is constituted by the two adjacent wiring traces of the plurality of wring traces. A ratio of the thickness t1 of the wiring trace to the distance d between the adjacent wiring traces is set to 0.8 or more. A cover insulating layer may be formed on the base insulating layer to cover the wiring traces. A metal layer having a predetermined thickness may be provided on a back surface of the base insulating layer. Furthermore, a differential impedance of each transmission line pair may be set to 100 [Omega].

Description

technical field [0001] The present invention relates to a flexible wiring circuit board. Background technique [0002] In information communication equipment such as mobile phones, a flexible printed circuit (hereinafter referred to as FPC) substrate is used as a digital signal transmission path between a central processing unit (hereinafter referred to as CPU) and a liquid crystal display. The FPC board mainly includes an insulating base layer and a conductive wiring pattern formed on the insulating base layer. [0003] In recent years, along with the increase in the amount of information transmitted by information communication equipment, the frequency of digital signals used has been increased. However, in the FPC board, since a digital signal in a high-frequency region is transmitted, high-frequency noise caused by harmonics may be generated in a wiring pattern. [0004] In this case, high-frequency noise generated from the FPC board may become a factor causing malfunc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/00
CPCH05K1/0245H05K1/0393H05K2201/09318H05K3/28H05K2201/09236
Inventor 大川忠男本上满山内大辅
Owner NITTO DENKO CORP
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