The present invention is a phenolic hydroxyl-containing aromatic
polyamide resin having a structure shown in the following formula (1) (in the formula, m and n are average values, and 0.005≤n / (m+n)<0.05, in addition m+n is a positive number from 2 to 200. Ar1 represents a
divalent aromatic group, Ar2 is a
divalent aromatic group with a phenolic hydroxyl group, Ar3 is a
divalent aromatic group), and the resin containing The resin composition, for example, relates to an
epoxy resin composition containing an
epoxy resin, etc., which does not hinder the good characteristics of the existing phenolic hydroxyl group-containing aromatic
polyamide resin, such as a cured product of an
epoxy resin composition containing the resin Among them, it has excellent properties such as flexibility, electrical properties, and
flame retardancy, and provides a phenolic hydroxyl-containing aromatic
polyamide resin with few ionic impurities and further improved adhesiveness.