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Polyamide resin, epoxy resin compositions, and cured articles thereof

A technology of epoxy resin and aromatic polyamide, which is applied to polyamide resin, can solve the problems such as the reduction of electrical characteristics, and achieve the effect of improving adhesiveness, excellent electrical characteristics, and high purity

Inactive Publication Date: 2008-06-25
NIPPON KAYAKU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When the molecular weight of the resin is relatively low and the viscosity is low, the phosphate ion can be sufficiently reduced by washing the resin with water, but since the viscosity of the polyamide resin increases as the molecular weight of the polyamide resin increases, it is difficult to sufficiently reduce it only by washing with water. Therefore, when this resin is used in electrical / electronic parts, etc., it may be the cause of the decrease in electrical characteristics.

Method used

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  • Polyamide resin, epoxy resin compositions, and cured articles thereof
  • Polyamide resin, epoxy resin compositions, and cured articles thereof
  • Polyamide resin, epoxy resin compositions, and cured articles thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0091] Nitrogen replacement was carried out in a flask with a thermometer, a condenser, and a stirrer, and 1.8 g of 5-hydroxyisophthalic acid, 81.3 g of isophthalic acid, 102 g of 3,4'-diaminodiphenyl ether, and chlorinated Lithium 3.4g, N-methylpyrrolidone 344g, pyridine 115.7g, after stirring and dissolving, add triphenyl phosphite 251g, react at 90 ℃ for 8 hours, promptly obtain containing the present invention shown in following formula (6): A reaction solution of a phenolic hydroxyl group-containing aromatic polyamide resin (A).

[0092]

[0093] (n / (n+m)=0.022 in formula (6)). After cooling the reaction solution to room temperature, it was poured into 500 g of methanol to precipitate the produced polyamide resin. The precipitated resin was separated by filtration, washed with 500 g of methanol, and then purified by reflux of methanol. Thereafter, after cooling the reflux liquid to room temperature, the resin was separated by filtration and dried to obtain a resin pow...

Embodiment 2

[0095] Except that 102 g of 3,4'-diaminodiphenyl ether in Example 1 was changed to 102 g of 4,4'-diaminodiphenyl ether, other operations were performed in the same manner as in Example 1 to obtain the compound containing the following formula (7). The reaction liquid of the aromatic polyamide resin (B) containing phenolic hydroxyl group of the present invention shown,

[0096]

[0097] (n / (m+n)=0.022 in formula (7)). And this reaction liquid was processed similarly to Example 1, and obtained resin powder (B). The obtained amount was 158 g, and the yield was 94%. 0.100 g of this resin powder (B) was dissolved in 20.0 ml of N,N-dimethylacetamide, and its intrinsic viscosity was measured at 30° C. using an Oswald viscometer to be 0.65 dl / g. The calculated value of active hydrogen equivalent with respect to an epoxy group was 3300 g / eq. Both ends of the obtained polyamide resin of the present invention were amino groups, and the average degree of polymerization (theoretical ...

Embodiment 3

[0099] 100 g of the reaction solution obtained in Example 1 was maintained at 90° C., 30 g of ion-exchanged water was added, and the resin was precipitated by cooling to 60° C. or lower. After removing the upper phase, 40 g of N,N-dimethylformamide was added and stirred at 60° C. for 30 minutes to dissolve uniformly, and then 30 g of ion-exchanged water was added to precipitate a resin. The precipitation and dissolution operation of the resin was repeated five times to obtain a resin solution, and then the moisture in the resin solution was removed under a reduced pressure of 0.02 MPa to obtain 75 g of the resin composition of the present invention having a resin concentration of 20% by weight. Take 1.00 ml of the resin composition of the present invention, and use an E-type rotational viscometer at 25° C. to measure its rotational viscosity to be 200 mPa·s.

[0100] In addition, 50 g of the resin composition of the present invention was poured into 50 g of methanol, and the p...

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Abstract

The present invention is a phenolic hydroxyl-containing aromatic polyamide resin having a structure shown in the following formula (1) (in the formula, m and n are average values, and 0.005≤n / (m+n)<0.05, in addition m+n is a positive number from 2 to 200. Ar1 represents a divalent aromatic group, Ar2 is a divalent aromatic group with a phenolic hydroxyl group, Ar3 is a divalent aromatic group), and the resin containing The resin composition, for example, relates to an epoxy resin composition containing an epoxy resin, etc., which does not hinder the good characteristics of the existing phenolic hydroxyl group-containing aromatic polyamide resin, such as a cured product of an epoxy resin composition containing the resin Among them, it has excellent properties such as flexibility, electrical properties, and flame retardancy, and provides a phenolic hydroxyl-containing aromatic polyamide resin with few ionic impurities and further improved adhesiveness.

Description

technical field [0001] The present invention relates to an aromatic polyamide resin containing a phenolic hydroxyl group, a resin composition containing the resin, and materials for flexible printed wiring boards using them, wherein the aromatic polyamide resin containing a phenolic hydroxyl group, High active hydrogen equivalent to epoxy group (less phenolic hydroxyl content), less ionic impurities, and higher viscosity. Background technique [0002] Epoxy resins can be cured with various curing agents, and generally become cured products with excellent mechanical properties, water resistance, chemical resistance, heat resistance, electrical properties, etc., and can be widely used in adhesives, coatings, laminates, molding materials, Casting materials and other fields. As the most commonly used epoxy resin at present, for example, bisphenol A type epoxy resin can be cited. Acid anhydrides and amine compounds are known as curing agents for epoxy resins, but in the field o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G69/32B32B15/08B32B15/092C08G59/62H05K1/03C08L77/10
CPCC08L77/10C08G59/54Y10T428/31515B32B2457/08H05K1/0353B32B27/08Y10T428/31522C08G69/32B32B27/38C08G69/265Y10T428/31511Y10T428/31725B32B15/08C08G69/46H05K1/03B32B27/34
Inventor 石川和纪内田诚赤塚泰昌
Owner NIPPON KAYAKU CO LTD
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