Automated dynamic cleaning device and method of tellurium-cadmium-mercury wafer solvent solution

Abstract

The invention discloses automated dynamic cleaning device and method of a tellurium-cadmium-mercury wafer solvent solution. The automated dynamic cleaning device comprises a polytetrafluoroethylene porous turnbuckle, a quartz beaker, a constant temperature water tank, a handle, a force arm lever, a slide block, a guide rail, a parallel connecting rod, a driving lever, a driving plate, a sliding chute and a storage rack. The automated dynamic cleaning method is characterized in that an organic or inorganic solvent is infused into the quartz beaker; the quartz beaker is placed in a water bath of the constant temperature water tank; a tellurium-cadmium-mercury wafer is erected in the polytetrafluoroethylene porous turnbuckle, immersed into the quartz beaker infused with the organic or inorganic solvent connected with mechanisms such as the force arm lever, the slide block, the parallel connecting rod, and the like through the turnbuckle handle and provided with power through a DC motor so that the polytetrafluoroethylene porous turnbuckle moves up and down to achieve the purpose of dynamic cleaning.

Description

technical field [0001] The invention relates to a manufacturing process technology of optoelectronic devices, in particular to an automatic dynamic cleaning device and method for a solvent solution of a tellurium mercury barrier wafer. Background technique [0002] There are many steps in the development process of the tellurium mercury barrier infrared detector. The process involves a series of processes such as surface treatment, dielectric film, photolithography, P-N junction, corrosion, metal electrode, interconnection, etc., and each process requires solvent Solution cleaning process. Mercury tellurium barrier is a kind of brittle semiconductor material, which is very important in the way of wafer handling and solvent solution cleaning. The traditional operation method is to use metal tweezers to pick it up in a solvent solution and clean it by ultrasonic vibration method or manual shaking method. [0003] With the development of the tellurium mercury barrier infrared...

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Problems solved by technology

[0004] For the solvent solution cleaning of mercury-tellurium-isolated wafers, the difficulty lies in that the ultrasonic vibration method is easy to break the wafer; the manual shaking method is not stable and repeatable because of the manual operation, and the shaking times are limited, so it is difficult to thoroughly clean the wafer surface stains. The consistency of each cleaning cannot be guaranteed; and both methods have a great impact on the yield of HgTe barrier wafers

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