Semiconductor package and manufacturing method thereof

Abstract

The invention discloses a packaged semiconductor piece and a production method thereof. The production method comprises the following steps of: providing a carrier with a pasting layer; configuring a plurality of chips on the pasting layer, wherein the active surface of each chip faces the pasting layer; forming a sealing compound for covering the chips to form a sealing compound body provided with opposite first surface and second surface and fully distributed with the chips, wherein the first surface is provided with a chip region and a marginal region; removing the carrier and the pasting layer so that the sealing compound body fully distributed with the chips exposes the active surfaces of all the chips; forming a plurality of welded balls evenly in the chip region and the marginal region; grinding the second surface of the sealing compound body fully distributed with the chips for reducing the thickness of the sealing compound body fully distributed with the chips, wherein the welded balls provide an even supporting force for the sealing compound body fully distributed with the chips; and cutting the sealing compound body fully distributed with the chips to form a plurality of packaged pieces.

Description

technical field [0001] The present invention relates to a semiconductor package and its process, and in particular to a redistribution chip encapsulant level package and its packaging process (Chip-redistribution Encapsulant Level Package Process). Background technique [0002] In recent years, electronic devices have been vigorously used in daily life, and the industry is all committed to developing miniature and multi-functional electronic products to meet market demands. At present, the industry has introduced many different types of semiconductor packages. However, most of the packaging processes are to first cut the multiple dies on the encapsulant of the redistributed chip into individual dies, and then package each individual die. and test. [0003] Different from the traditional packaging technology that takes a single chip (die) as the processing target, the chip-redistribution encapsulant level package (Chip-redistribution Encapsulant Level Package) is based on th...

AI Technical Summary

Problems solved by technology

The chip 2301 near the edge area A1 and the chips 2302 and 2303 near the alignment mark component 220 are broken

In particular, chip breakage cannot be detected automatically by the machine, and each chip must be inspected manually through an optical microscope, which increases the cost of manpower.

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