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Detection method for interlayer combination of PCB product with metal base

A technology of interlayer bonding and detection method, which is applied in the direction of using sonic/ultrasonic/infrasonic waves to analyze solids, which can solve the problems of damaged samples, long slicing process cycle, affecting slicing detection results, etc., to improve accuracy and efficiency, and avoid time-consuming Effortless, Integrity Guaranteed Effect

Inactive Publication Date: 2010-12-29
SHENNAN CIRCUITS
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Problems solved by technology

[0004] In the interlayer bonding detection process of the above-mentioned PCB products with a metal base, since the slices are used for observation, the samples must be destroyed in the process of making the slices, which cannot guarantee the completeness of the samples, and in the process of slicing , there may be artificial reasons to damage the sample, thus affecting the detection results of the slices
In addition, in the above detection process, the process cycle of slicing is long, which affects the work efficiency of detection.

Method used

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  • Detection method for interlayer combination of PCB product with metal base
  • Detection method for interlayer combination of PCB product with metal base

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Embodiment Construction

[0015] In order to understand the solutions provided by the embodiments of the present invention more clearly, the technical terms in the embodiments are explained as follows:

[0016] PCB: printed circuit board.

[0017] Metal base: a metal block (steel, iron, aluminum block) used for PCB heat dissipation, generally pressed together with the PCB through an adhesive sheet.

[0018] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] The embodiment of the present invention discloses a detection method for the i...

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Abstract

The embodiment of the invention discloses a detection method for the interlayer combination of a PCB product with a metal base. The detection method comprises the following steps of: a, performing transmission mode scanning on the PCB product with the metal base by using ultrasonic scanning equipment; finishing detecting if the PCB product with the metal base has no layered blister phenomenon; and turning to a step b if the PCB product with the metal base has the layered blister phenomenon; and b, performing reflection mode scanning on the PCB product with the metal base by using the ultrasonic scanning equipment; and determining the position of layered blister. In the detection method provided by the embodiment of the invention, the interlayer combination situation of the PCB product with the metal base can be detected accurately and rapidly on the premise of not damaging a sample.

Description

technical field [0001] The invention relates to the technical field of PCB product detection, and more specifically relates to a detection method for interlayer bonding of PCB products with a metal base. Background technique [0002] A PCB product with a metal base refers to a PCB product that has a metal block that is pressed together with the PCB through an adhesive sheet to perform a heat dissipation function. Compared with ordinary PCB products, PCB products with metal bases increase the metal base combined with PCB products, which has a good heat dissipation effect. Due to the large difference in the thermal expansion coefficient of the adhesive sheet, the metal base, and the PCB, in the subsequent processing of the PCB product, due to the effect of thermal expansion, delamination and blistering are prone to occur between the PCB, the adhesive sheet, and the adhesive sheet. Therefore, in the subsequent processing of PCB, it is necessary to detect the interlayer bonding...

Claims

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Application Information

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IPC IPC(8): G01N29/04
Inventor 江京向洪波孔令文彭勤卫
Owner SHENNAN CIRCUITS
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