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Method for manufacturing electronic component module

A technology of electronic components and manufacturing methods, applied in the fields of printed circuit manufacturing, multilayer circuit manufacturing, electrical components, etc., which can solve problems such as component damage, difficulty in ensuring joint reliability, and cracking of solder joints

Inactive Publication Date: 2011-01-26
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This may lead to fatal problems such as damage to components, cracking of solder joints, etc.
Then, in the conventional manufacturing method of the electronic component module, in the step of laminating the thermosetting sheet for forming the sealing resin layer, a problem caused by distortion of the base wiring layer generated during component mounting is likely to occur, There is a problem that it is difficult to ensure joint reliability

Method used

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  • Method for manufacturing electronic component module
  • Method for manufacturing electronic component module
  • Method for manufacturing electronic component module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0047] Hereinafter, embodiments of the present invention will be described with reference to the drawings. Figure 1A ~ Figure 1H It is explanatory drawing of the 1st step which shows the manufacturing method of the electronic component module which concerns on one Embodiment of this invention. figure 2 It is an explanatory diagram of twisting and deformation of the base wiring layer in the method of manufacturing the electronic component module according to the embodiment of the present invention. Figure 3A ~ Figure 3C It is explanatory drawing of the 2nd step which shows the manufacturing method of the electronic component module which concerns on one Embodiment of this invention.

[0048] exist Figure 1A Among them, the base wiring layer 1 has a structure in which a wiring pattern 3 and a wiring pattern 4 are respectively formed on an upper surface 2 a and a lower surface 2 b of an insulating resin substrate 2 . A part of the wiring pattern 3 is the junction part 3a, 3b...

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Abstract

A method for manufacturing an electronic component module is provided with a step of arranging a bonding material (5) wherein solder particles are contained in a thermosetting resin, in a region which is on an upper surface of a base wiring layer (1) and covers at least a land section (3a), and a step of holding an electronic component (6) by a base wiring layer (1) by aligning a terminal section (6b) with the land section (3a) and bonding at least a terminal section (6b) to a bonding material (5) covering the land section (3a). Then, by semi-hardening the bonding material (5) by heating, warping deformation of the base wiring layer is suppressed and bonding reliability is ensured.

Description

technical field [0001] The present invention relates to a method of manufacturing an electronic component module in which electronic components are mounted on a base wiring layer on which a wiring pattern is formed, and the electronic component and the wiring pattern are sealed with a sealing resin layer. Background technique [0002] Generally, electronic components such as semiconductor elements are incorporated in electronic equipment in the form of electronic component modules in which electronic components mounted on a base wiring layer such as a resin substrate are resin-sealed. As the mounting density of electronic component modules is required to be higher, a so-called component-embedded substrate in which electronic components are mounted on inner layers of a plurality of stacked electrode patterns is used as an electronic component module (for example, refer to Patent Document 1). In this Patent Document 1, prepregs serving as thermosetting sheets for forming seali...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/34H05K3/46
CPCH01L2224/83851H01L2224/2929H01L24/81H05K1/186H01L2224/73204H05K2203/0278H01L24/83H01L2224/293H05K3/3484H01L2224/83192H05K2201/10977H05K2201/10674H01L2224/16225H05K2201/10636H05K3/341H05K3/323H01L2924/19105H01L2924/3511H05K3/3485Y02P70/50
Inventor 境忠彦本村耕治永福秀喜
Owner PANASONIC CORP