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Substrate inspection device and substrate inspection method

A substrate inspection and substrate technology, applied in the direction of electrical components, electrical components, etc., can solve the problems of not being able to identify the installation position of parts, low efficiency, and reducing the total throughput of the installation line.

Active Publication Date: 2011-02-09
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This has the problem of inefficiency (also reducing the overall throughput of the mounting line) because even parts mounting locations that do not substantially need to be inspected prior to part mounting, and on which parts are already mounted, are inspected
In addition, when a part is mounted on a part mounting position, since the part mounting position may be hidden by the part mounted thereon in many cases, in the inspection before the part mounting in the re-input of the substrate, when to When the part mounting position is recognized in the same field of view as the recognition camera set for the first inspection, the part mounting position cannot be recognized in the field of view, which can be judged as abnormal, and thus may cause a system error to occur

Method used

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  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method
  • Substrate inspection device and substrate inspection method

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Embodiment Construction

[0019] Hereinafter, embodiments of the present invention will be described with reference to the drawings. figure 1 is a perspective view of a part mounter attached to a substrate inspection apparatus according to an embodiment of the present invention, figure 2 is a plan view of a component mounter attached to a substrate inspection apparatus according to an embodiment of the present invention, image 3 is a block diagram showing a control system of a part mounter attached to a substrate inspection apparatus according to an embodiment of the present invention, Figure 4 is a plan view of an exemplary substrate on which a component is mounted by a component mounter attached to the substrate inspection apparatus according to an embodiment of the present invention, Figure 5 and Figure 6 is a flowchart showing the steps of component mounting performed by the component mounter attached to the substrate inspection apparatus according to the embodiment of the present invention....

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Abstract

An inspection process before component mounting for all component mounting positions on which components are to be mounted is performed when a reenter mode is not set by operation of a reenter switch, a recognition camera is first caused to recognize the component mounting position and then a component presence inspection process which inspects whether or not the component is mounted on the component mounting position is performed when the reenter mode is set by the reenter switch, and, the inspection process before component mounting is performed for the component mounting position on which the component is not mounted.

Description

technical field [0001] The present invention relates to a substrate inspection apparatus and a substrate inspection method for inspecting whether a part can be mounted on a component mounting position on a substrate before mounting the part. Background technique [0002] The component mounter moves the mounting head relative to the positioned substrate, picks up the component supplied from the component supply unit, and mounts the component on the component mounting position on the substrate. The board inspection device is deployed on the upstream side of the part mounter (the upstream side of the board flow) in the part mounting line, and the board inspection device recognizes the part mounting position on the board by the recognition camera before the parts are mounted on the board, and inspects Whether a part can be mounted on a part mounting position (inspection before part mounting) (Patent Documents 1 and 2). [0003] Although the part mounter does not mount the part ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/08
CPCH05K13/08H05K13/0413H05K13/0812
Inventor 戒田健一东升粟田义明永尾和英角英树
Owner PANASONIC CORP