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Waterproof heat-radiating mechanism of case

A technology of heat dissipation mechanism and chassis, applied in the direction of chassis/cabinet/drawer parts, cooling/ventilation/heating transformation, electrical components, etc., can solve problems affecting work progress, machine damage, etc.

Inactive Publication Date: 2014-07-09
太空医疗仪器(苏州)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002]In life and production, many machines will generate high temperature during operation, so it is necessary to install a cooling mechanism on the machine chassis. If the cooling mechanism is not designed properly, it may be caused by the staff operating the machine. Water flows into the chassis due to negligence, which will not only cause damage to the machine, but also affect the work progress, which is not a small loss to the individual or the unit.

Method used

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  • Waterproof heat-radiating mechanism of case
  • Waterproof heat-radiating mechanism of case
  • Waterproof heat-radiating mechanism of case

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Embodiment Construction

[0012] Below in conjunction with accompanying drawing, the cabinet waterproof cooling mechanism of the present invention is described in detail:

[0013] Such as Figure 1~3 The waterproof and heat dissipation mechanism of the chassis shown in the figure includes a plurality of grooves 11 arranged at intervals up and down on the back of the chassis 1, and a plurality of cooling holes 12 provided on the grooves 11 to communicate with the inside and outside of the chassis, and formed between two adjacent grooves 11. A clamping plate 13, and the upper surface of the clamping plate 13 is an inclined surface, the height of the outer edge 131 of the inclined surface relative to the bottom of the casing 1 is smaller than the height of the inner edge 132 of the inclined surface relative to the bottom of the casing 1.

[0014] In this embodiment, two rows are staggered up and down in each groove 11 , and the spacing of the cooling holes 12 in each row is equal, so that the casing...

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Abstract

The waterproof and heat dissipation mechanism of the invention chassis includes a number of grooves on the back of the case, and multiple heat dissipation holes that are opened on the grooves on the groove.The surface of the splint is a tilt surface, and the outer edge of the tilt surface is less than the height of the bottom of the case than the height of the bottom edge near the inside of the case to the bottom of the case.When the staff accidentally sprinkle the water on the case, the top surface of the splint is blocked by most of the water on the box, which greatly reduces the possibility of water into the chassis to cause damage to the machine.Guarantee the normal progress of work.

Description

technical field [0001] The invention relates to a case on an electronic device, in particular to a heat dissipation mechanism arranged on the case. Background technique [0002] In life and production, many machines will generate high temperature during operation, so it is necessary to install a heat dissipation mechanism on the machine chassis. If the heat dissipation mechanism is not designed properly, water may flow into the chassis due to the negligence of the staff when operating the machine, which will not only cause damage to the machine , It also affects the work progress, which is not a small loss to the individual or the unit. Contents of the invention [0003] The purpose of the present invention is to provide a heat dissipation mechanism that can effectively prevent water from entering the inside of the chassis. [0004] In order to solve the above problems, the solution adopted by the present invention is: a waterproof and heat dissipation mechanism for the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K5/00H05K5/02H05K7/20
Inventor 王志聪
Owner 太空医疗仪器(苏州)有限公司