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Radiating system

A heat dissipation system and air flow technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of energy consumption, high noise, high component cost, etc., to increase air intake and improve heat dissipation efficiency , The effect of simplifying the overall system components

Inactive Publication Date: 2012-10-10
SUNONWEALTH ELECTRIC MACHINE IND
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AI Technical Summary

Problems solved by technology

[0005] However, since the heat dissipation fan of the existing heat dissipation system only has a horizontal and radial one-way air supply capability, each of the heating elements can only be arranged on the horizontal radial position of the heat dissipation fan; so that if the heating elements are blocked by other larger components (such as circuit boards) and located in different spaces, the cooling fan will not be able to dissipate heat from the components located in different spaces, resulting in the need for electronic products Only by installing at least two cooling fans corresponding to the heating elements in different spaces can the heat be dissipated for the heating elements located in different spaces. It can be seen that the existing cooling system cannot effectively reduce the number of cooling fans in the electronic product, so it is still There are concerns such as excessive noise, energy consumption, high cost of components, and the inability to simplify the number of components, which is not conducive to product miniaturization.

Method used

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  • Radiating system
  • Radiating system
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Embodiment Construction

[0025] In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:

[0026] Please refer to figure 1 and figure 2 As shown, the heat dissipation system of the first embodiment of the present invention is mainly used to dissipate heat from several electronic components 9 (for example: microprocessors, chipsets or passive components, etc.), and it includes a housing 1 and a partition 2 , a drive unit 3, a first fan wheel 4 and a second fan wheel 5, the casing 1 forms an inner space 11, the inner space 11 is used to accommodate each of the electronic components 9, and the partition plate 2, The driving unit 3 , the first fan wheel 4 and the second fan wheel 5 are also accommodated in the inner space 11 . The first fan wheel 4 and the second fan wheel 5 are respectively combined wi...

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Abstract

A radiating system is provided with an internal space, wherein the internal space is separated into at least two adjacent cavities by a separator plate, and the separator plate is provided with a through hole for connecting one cavity with the other cavity. The radiating system also comprises a driving unit, a first impeller and a second impeller, wherein the driving unit is arranged in one cavity, is combined with the first impeller and the second impeller respectively, is arranged in the same cavity with the first impeller, and the second impeller is arranged in the other cavity. The systemuses the single driving unit to drive the first impeller and the second impeller in the two adjacent cavities to rotate at the same time, in order to radiate the electronic component in the two adjacent cavities and simplify the integral system.

Description

technical field [0001] The present invention relates to a cooling system, in particular to a cooling system capable of cooling several adjacent spaces at the same time. Background technique [0002] With the rapid improvement of the performance of electronic products, the operating temperature of the internal system of electronic products is also more and more likely to rise. For normal operation at the operating temperature, most of the components use the corresponding heat dissipation design for heat dissipation. [0003] At present, most of the heat dissipation designs adopted by electronic products for their internal electronic components use cooling fans to drive wind and cool down the electronic components. The heat dissipation fins made of heat-conducting metal material are correspondingly pasted on one side of the electronic components, so as to dissipate heat for different electronic components and achieve the purpose of cooling down. As a result, there will be to...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20H01L23/467
Inventor 洪银树李明聪李朝勋
Owner SUNONWEALTH ELECTRIC MACHINE IND