Radiating system
A heat dissipation system and air flow technology, applied in the direction of cooling/ventilation/heating transformation, electrical components, electric solid devices, etc., can solve the problems of energy consumption, high noise, high component cost, etc., to increase air intake and improve heat dissipation efficiency , The effect of simplifying the overall system components
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[0025] In order to make the above-mentioned and other objects, features and advantages of the present invention more comprehensible, the preferred embodiments of the present invention are specifically cited below, together with the accompanying drawings, as follows:
[0026] Please refer to figure 1 and figure 2 As shown, the heat dissipation system of the first embodiment of the present invention is mainly used to dissipate heat from several electronic components 9 (for example: microprocessors, chipsets or passive components, etc.), and it includes a housing 1 and a partition 2 , a drive unit 3, a first fan wheel 4 and a second fan wheel 5, the casing 1 forms an inner space 11, the inner space 11 is used to accommodate each of the electronic components 9, and the partition plate 2, The driving unit 3 , the first fan wheel 4 and the second fan wheel 5 are also accommodated in the inner space 11 . The first fan wheel 4 and the second fan wheel 5 are respectively combined wi...
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