Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A surface mount, rapid curing technology, applied in the direction of adhesives, adhesive types, modified epoxy resin adhesives, etc., can solve problems such as low bond strength, unstable storage period, and adhesives that cannot be cured at low temperature. Achieve fast curing speed, stable storage period and good thixotropy
Active Publication Date: 2013-05-01
深圳市库泰克电子材料技术有限公司
View PDF2 Cites 0 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0012] In order to solve the technical problems that the existing surface mount adhesive cannot be cured at low temperature and the bond strength is low and the storage period is unstable, the present invention provides a surface mount adhesive that can be cured quickly at low temperature, has a stable storage period and high adhesion
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0046] The following raw materials of the present embodiment are configured by weight percentage:
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
PUM
Property
Measurement
Unit
shear strength
aaaaa
aaaaa
cure temperature
aaaaa
aaaaa
shear strength
aaaaa
aaaaa
Login to View More
Abstract
The invention discloses a low-temperature rapidly-curable surface mounting adhesive, which is prepared from the following raw materials in percent by weight: 5.8 to 59 percent of bisphenol epoxy resin, 5.8 to 59 percent of modified epoxy resin, 2 to 10 percent of toughening agent, 0.5 to 14.5 percent of latent curing agent, 1.5 to 10.5 percent of accelerator, 20 to 59 percent of thixotropic agent, 1.1 to 10.8 percent of coupling agent, 0.5 to 14.8 percent of inorganic filler and 0 to 6 percent of dye. Due to the adoption of the component proportions, the low-temperature rapidly-curable surface mounting adhesive overcomes the shortcomings of the conventional surface mounting adhesive, and has the advantages of (1) stable storage period, (2) low viscosity and high dispensing performance, (3) low linear expansion coefficient of 40 to 60ppm / DEG C, (4) short curing time of 5 minutes at 80 DEG C, (5) shearing strength of 16MPa and the like.
Description
technical field [0001] The invention relates to an adhesive for surface mounting, in particular to a surface mounting adhesive which can be used for heat-sensitive components and can be quickly cured at low temperature and has high adhesive performance. Background technique [0002] As a new generation of electronic assembly technology, surface mount technology (SMT) has penetrated into various fields. SMT has developed rapidly and is widely used, and has completely replaced traditional electronic assembly technology in many fields. With its own characteristics and advantages, SMT has brought about fundamental and revolutionary changes in electronic assembly technology, and has continuously developed and improved in the process of application. Surface mount technology (SMT) is a brand-new technology of today's electronic components. It directly solders tiny leadless components or components with extremely short leads to printed circuit boards. Using this technology, the vol...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to View More 
