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Low-temperature rapidly-curable surface mounting adhesive

A surface mount, rapid curing technology, applied in the direction of adhesives, adhesive types, modified epoxy resin adhesives, etc., can solve problems such as low bond strength, unstable storage period, and adhesives that cannot be cured at low temperature. Achieve fast curing speed, stable storage period and good thixotropy

Active Publication Date: 2013-05-01
深圳市库泰克电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] In order to solve the technical problems that the existing surface mount adhesive cannot be cured at low temperature and the bond strength is low and the storage period is unstable, the present invention provides a surface mount adhesive that can be cured quickly at low temperature, has a stable storage period and high adhesion

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The following raw materials of the present embodiment are configured by weight percentage:

[0047]862 epoxy resin 5.8%

[0048] Four-functional dipentadiene epoxy resin 29.6%

[0049] Acrylic rubber 2%

[0050] PN-40 curing agent 0.5%

[0051] Mercaptobenzothiazole 1.5%

[0052] Bentonite 59%

[0053] 3-Glycidoxypropyltrimethoxysilane 1.1%

[0054] Aluminum Oxide 0.5%

Embodiment 2

[0056] The weight percent of the underfill with low viscosity and low coefficient of linear expansion described in this embodiment is:

[0057] 862 epoxy resin 16.1%

[0058] Four-functional dipentadiene epoxy resin 5.8%

[0059] Acrylic rubber 6%

[0060] PN-40 curing agent 14.5%

[0061] Mercaptobenzothiazole 6%

[0062] Nano Anhydrous Silica 20%

[0063] 3-Glycidoxypropyltrimethoxysilane 10.8%

[0064] Alumina 14.8%

[0065] Red Pigment 6%

Embodiment 3

[0067] The weight percent of the underfill with low viscosity and low coefficient of linear expansion described in this embodiment is:

[0068] 862 epoxy resin 32.4%

[0069] Four-functional dipentadiene epoxy resin 5.9%

[0070] Acrylic rubber 10%

[0071] PN-40 curing agent 7.5%

[0072] Trioctyl Phosphate 10.5%

[0073] Nano Anhydrous Silica 20%

[0074] 3-Glycidoxypropyltrimethoxysilane 6 %

[0075] Aluminum oxide 7.7 %

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Abstract

The invention discloses a low-temperature rapidly-curable surface mounting adhesive, which is prepared from the following raw materials in percent by weight: 5.8 to 59 percent of bisphenol epoxy resin, 5.8 to 59 percent of modified epoxy resin, 2 to 10 percent of toughening agent, 0.5 to 14.5 percent of latent curing agent, 1.5 to 10.5 percent of accelerator, 20 to 59 percent of thixotropic agent, 1.1 to 10.8 percent of coupling agent, 0.5 to 14.8 percent of inorganic filler and 0 to 6 percent of dye. Due to the adoption of the component proportions, the low-temperature rapidly-curable surface mounting adhesive overcomes the shortcomings of the conventional surface mounting adhesive, and has the advantages of (1) stable storage period, (2) low viscosity and high dispensing performance, (3) low linear expansion coefficient of 40 to 60ppm / DEG C, (4) short curing time of 5 minutes at 80 DEG C, (5) shearing strength of 16MPa and the like.

Description

technical field [0001] The invention relates to an adhesive for surface mounting, in particular to a surface mounting adhesive which can be used for heat-sensitive components and can be quickly cured at low temperature and has high adhesive performance. Background technique [0002] As a new generation of electronic assembly technology, surface mount technology (SMT) has penetrated into various fields. SMT has developed rapidly and is widely used, and has completely replaced traditional electronic assembly technology in many fields. With its own characteristics and advantages, SMT has brought about fundamental and revolutionary changes in electronic assembly technology, and has continuously developed and improved in the process of application. Surface mount technology (SMT) is a brand-new technology of today's electronic components. It directly solders tiny leadless components or components with extremely short leads to printed circuit boards. Using this technology, the vol...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J163/02C09J163/10C09J11/04
Inventor 黄伟进叶婷
Owner 深圳市库泰克电子材料技术有限公司
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