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Underfill with low viscosity and low linear expansion coefficient

An underfill and linear expansion coefficient technology, which is used in the field of low viscosity and low linear expansion underfills, can solve the problems that the low viscosity and low linear expansion coefficient of the filler is not ideal, and achieve good fluidity, Low viscosity and stable shelf life

Active Publication Date: 2012-12-26
深圳市库泰克电子材料技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] In order to solve the technical problem that the comprehensive performance of low viscosity and low linear expansion coefficient of the existing filling glue is not ideal, the present invention provides a low viscosity, low linear expansion coefficient, high bonding ability, and high reliability for flip-chip mounting. Underfill

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Bisphenol F epoxy resin: 0%, silicone modified epoxy resin: 0%, low viscosity butadiene rubber: 0.57%, cycloaliphatic epoxy resin: 84.2%, diethyltoluenediamine: 0.57 %, PN-23 amine compound accelerator: 0.55%, 3-aminopropylethyldimethoxysilane: 0.55%, 3-glycidylpropyltrimethoxysilane: 0.57%, spherical particle size of 5um Silica powder: 12.9%, carbon black: 0.09%.

Embodiment 2

[0033] Bisphenol F epoxy resin: 28.6%, silicone modified epoxy resin: 28.6%, low viscosity butadiene rubber: 2%, alicyclic epoxy resin: 16.3%, anhydride curing agent: 2%, PN -23 Amine compound accelerator: 1.5%, 3-aminopropylethyldimethoxysilane: 1.25%, 3-glycidylpropyltrimethoxysilane: 1.25%, spherical silica powder with a particle size of 5um: 18%, carbon black: 0.5%.

Embodiment 3

[0035] Bisphenol F epoxy resin: 10.3%, silicone modified epoxy resin: 10.3%, low viscosity butadiene rubber: 15.4%, alicyclic epoxy resin: 20%, anhydride curing agent: 15.4%, HX3722 Amine compound accelerator: 5.56%, 3-aminopropylethyldimethoxysilane: 5.56%, 3-glycidylpropyltrimethoxysilane: 0.68%, spherical silica powder with a particle size of 5um: 16% , Carbon black: 0.8%.

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PUM

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Abstract

The invention discloses underfill with low viscosity and low linear expansion coefficient for flip-chip packaging, which is prepared with the following raw materials by weight percent: 0-28.6 percent of bisphenol-type epoxy resin, 0-28.6 percent of organosilicon modified epoxy resin, 0.57-15.4 percent of toughening agent, 16.3-84.2 percent of alicyclic epoxy resin, 0.57-15.4 percent of latent curing agent, 0.55-5.56 percent of accelerator, 0.55-5.56 percent of surfactant, 0.57-27 percent of coupling agent, 7.4-66.7 percent of inorganic filler and 0-7.9 percent of pigment. With the ratio of the components, the invention overcomes the defects of the existing underfill, and has the advantages of: (1) high stability in the storage period; (2) low viscosity and good fluidity, wherein the viscosity is 1000-2000 centipoises; (3) low linear expansion coefficient (20-40ppm per DEG C); (4) high curing speed, wherein the underfill can be cured for 130 degrees within 5 minutes; (5) high shear strength (15MPa) and the like.

Description

technical field [0001] The present invention relates to an underfill glue for chip packaging, in particular to a micro gap mainly used for high integration of semiconductor equipment and flip-chip semiconductor devices, which can be packaged in a short time and meet the needs of packaging reliability and high fluidity Enhanced low viscosity, low coefficient of linear expansion underfill. Background technique [0002] With the high integration and high density of IC chips, and the miniaturization of IC components, the application of flip-chip mounting methods is becoming more and more extensive. In this mounting method, the IC chip and the printed wiring board are connected through small and thin solder bumps, not through bonding wires. However, since the thermal expansion coefficients of chips, printed wiring boards, and solder are different, thermal stress is likely to occur during thermal shock tests. In particular, the local thermal stress of the solder bump far from th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/02C08L9/00C08K13/04C08K3/34C08K3/04C08K5/544C08K5/5435C08K5/5425H01L23/29H01L21/56
Inventor 黄伟进叶婷
Owner 深圳市库泰克电子材料技术有限公司
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