Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same

A technology of epoxy resin and composition, applied in the direction of circuit substrate materials, layered products, metal layered products, etc., can solve the problems of low tracking index, heat evaporation of moisture pollutants, breakdown short circuit/open circuit, etc. , to achieve the effect of avoiding dry flowers or exposed cloth lines, high CTI and flame retardancy, and high tracking characteristics

Active Publication Date: 2013-01-23
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronics in the direction of lightness, thinness, shortness and multi-function, printed circuit substrates, which are the main support of electronic components, are also becoming thinner, miniaturized and high-density; Higher requirements are put forward for the insulation reliability performance of the circuit board, especially under relatively harsh environmental conditions; at this time, when the surface of the insulating substrate of the circuit board is polluted by dust adhesion, moisture condensation or moisture erosion and ion pollutants, Under the action of an applied voltage, since the leakage current on the surface is much higher than that of a clean surface, the heat generated by the leakage current evaporates moisture pollutants, making the surface of the insulating substrate in an unstable state, prone to sparks, and reducing the insulation. In severe cases, it will break down and short circuit / open circuit; ordinary epoxy resin copper clad laminates have relatively low tracking resistance index, and it is generally difficult to reach 240V. Therefore, it is necessary to improve the relative tracking index of insulating materials
[0003] The existing high relative tracking index (CTI) copper-clad laminate is formed by using a glass cloth reinforced adhesive sheet with high CTI characteristics on the surface adhesive sheet, and then pressing it, but because the adhesive sheet is prone to Due to the matching of glass cloth and resin and the poor control of the index of the bonding sheet, the board has dried flowers or exposed cloth lines, and the thickness precision control problem affects the tracking index of the board.
The patent application No. 200810220680.2 discloses a halogen-free high CTI resin-attached copper foil and a copper-clad laminate. Although the resin-attached copper foil can be obtained by continuous coating, the copper foil cannot be obtained after coating. It is basically fixed, and the thickness specification cannot be changed. In addition, when the resin-attached copper foil is cut, the resin powder is easy to scatter and pollute the copper foil surface

Method used

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  • Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same
  • Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same
  • Halogen-free flame retardant epoxy resin composition and copper clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation of Halogen-free Flame Retardant Epoxy Resin Composition Glue

[0039] Weigh 44 parts of bisphenol A epoxy resin (Epikote 1002), 30 parts of carboxyl-terminated nitrile rubber (Nipol1072CG), 26 parts of phosphorus-containing phenolic resin (XZ92741), 20 parts of nitrogen-based flame retardant (melapurMC15), hydrogen 30 parts of aluminum (average particle size is 1 to 5um, purity above 99%), 0.7 part of dicyandiamide and 0.1 part of 2-ethyl-4-methylimidazole, dissolve the above components with dimethylformamide solvent to form a gel Liquid, the solid content of the glue is adjusted to 50%, and the glue of the halogen-free flame-retardant epoxy resin composition is made.

[0040] Preparation of copper clad laminate

[0041] Stack 8 sheets of FR-4 prepregs or bonding sheets with a size of 300mm×300mm neatly, and apply the prepared glue on the laminate through the coating machine on the upper and lower sides, with a thickness of 50 μm. Then put it into an oven ...

Embodiment 2

[0043] Repeat the preparation of Example 1, the difference is that in the glue system of the halogen-free flame-retardant epoxy resin composition, 35 parts of bisphenol A type epoxy resin (Epikote 1002), 30 parts of carboxyl-terminated nitrile rubber (Nipol1072CG), 13 parts of phosphorus-containing epoxy resin (YEP-250), 22 parts of phosphorus-containing phenolic resin (XZ92741), 10 parts of nitrogen-based flame retardant (melapur MC15), aluminum hydroxide (average particle size 1 to 5 μm, purity 99% 30 parts of the above), 0.45 parts of dicyandiamide and 0.1 part of 2-ethyl-4-methylimidazole, and the preparation of other steps is the same as in Example 1.

Embodiment 3

[0045] Repeat the preparation of Example 1, the difference is that in the glue system of the halogen-free flame-retardant epoxy resin composition, 19 parts of bisphenol A type NOVOLAC epoxy resin (EPR627, manufactured by Hexion Company) and bisphenol A type epoxy resin are used. (Epikote 1002) 25 parts, carboxyl-terminated nitrile rubber (Nipol 1072CG) 30 parts, phosphorus-containing phenolic resin (XZ92741) 26 parts, nitrogen-based flame retardant (melapur MC15) 10 parts, aluminum hydroxide (average particle size 1 to 5 μm, purity above 99%) 30 parts, 0.75 parts of dicyandiamide and 0.1 part of 2-ethyl-4-methylimidazole, and the preparation of other steps is the same as in Example 1.

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Abstract

The invention relates to a halogen-free flame retardant epoxy resin composition and a copper clad plate prepared from the same. The halogen-free flame retardant epoxy resin composition comprises bisphenol A epoxy resin, carboxyl-terminated butadiene acrylonitrile, phosphorous resin, nitrogen fire retardant, amine curing agent, curing accelerator, filler and organic solvent. The copper clad plate prepared from the halogen-free flame retardant epoxy resin composition comprises a halogen-free flame retardant epoxy resin composition layer arranged on one or both surfaces of the laminated plate, and a copper foil pressed on the halogen-free flame retardant epoxy resin composition layer, wherein the laminated plate comprises a plurality of bonded sheets, and the halogen-free flame retardant epoxy resin composition layer is formed by coating the halogen-free flame retardant epoxy resin composition. The halogen-free flame retardant epoxy resin composition provided by the invention has high tracking property. The copper clad plate prepared from the halogen-free flame retardant epoxy resin composition has high CTI (comparative tracking index), good fire resistance and other good overall properties, has good processing characteristics, avoids dried flower dry flowers, cloth mark exposure and defects, and is suitable for fabricating single-sided or double-sided printed circuit boards withmanufacturing requirement on CTI larger than or equal to 400 V.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free flame-retardant epoxy resin composition and a copper-clad board made using the same. Background technique [0002] With the development of electronics in the direction of lightness, thinness, shortness and multi-function, printed circuit substrates, which are the main support of electronic components, are also becoming thinner, miniaturized and high-density; Higher requirements are put forward for the insulation reliability performance of the circuit board, especially under relatively harsh environmental conditions; at this time, when the surface of the insulating substrate of the circuit board is polluted by dust adhesion, moisture condensation or moisture erosion and ion pollutants, Under the action of an applied voltage, since the leakage current on the surface is much higher than that of a clean surface, the heat generated by the leakage current evaporates moisture pollut...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L13/00C08L63/00C08L61/06B32B15/092H05K1/03
Inventor 方克洪
Owner GUANGDONG SHENGYI SCI TECH
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