Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same

A technology of epoxy resin and composition, applied in the direction of epoxy resin glue, synthetic resin layered product, aldehyde/ketone condensation polymer adhesive, etc. , breakdown short circuit/open circuit and other problems, to avoid dry flower or exposed cloth pattern, high CTI and flame resistance, high leakage and tracking characteristics

Active Publication Date: 2011-07-20
GUANGDONG SHENGYI SCI TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronics in the direction of lightness, thinness, shortness and multi-function, printed circuit substrates, which are the main support of electronic components, are also becoming thinner, miniaturized and high-density; Higher requirements are put forward for the insulation reliability performance of the circuit board, especially under relatively harsh environmental conditions; at this time, when the surface of the insulating substrate of the circuit board is polluted by dust adhesion, moisture condensation or moisture erosion and ion pollutants, Under the action of an applied voltage, since the leakage current on the surface is much higher than that of a clean surface, the heat generated by the leakage current evaporates moisture pollutants, making the surface of the insulating substrate in an unstable state, prone to sparks, and reducing the insulation. In severe cases, it will break down and short circuit / open circuit; ordinary epoxy resin copper clad laminates have relatively low tracking resistance index, and it is generally difficult to reach 240V. Therefore, it is necessary to improve the relative tracking index of insulating materials
[0003] The existing high relative tracking index (CTI) copper-clad laminate is formed by using a glass cloth reinforced adhesive sheet with high CTI characteristics on the surface adhesive sheet, and then pressing it, but because the adhesive sheet is prone to Due to the matching of glass cloth and resin and the poor control of the index of the bonding sheet, the board has dried flowers or exposed cloth lines, and the thickness precision control problem affects the tracking index of the board.
The patent application No. 200810220680.2 discloses a halogen-free high CTI resin-attached copper foil and a copper-clad laminate. Although the resin-attached copper foil can be obtained by continuous coating, the copper foil cannot be obtained after coating. It is basically fixed, and the thickness specification cannot be changed. In addition, when the resin-attached copper foil is cut, the resin powder is easy to scatter and pollute the copper foil surface

Method used

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  • Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same
  • Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same
  • Halogen-free flame-retardant epoxy resin composition, and adhesive film and copper-clad plate prepared from same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] Preparation of Glue and Film of Halogen-free Flame Retardant Epoxy Resin Composition

[0039] Weigh 44 parts by weight of bisphenol A epoxy resin (Epikote 1002), 30 parts by weight of carboxyl-terminated nitrile rubber (Nipol 1072CG), 26 parts by weight of phosphorus-containing phenolic resin (XZ92741), nitrogen-based flame retardant (melapur MC15) 20 parts by weight, 30 parts by weight of aluminum hydroxide (average particle diameter is 1 to 5um, purity more than 99%), 0.7 parts by weight of dicyandiamide and 0.1 parts by weight of 2-ethyl-4-methylimidazole, with dimethyl The formamide solvent dissolves the above components to form a glue solution, and the solid content of the glue solution is adjusted to 50% to prepare a halogen-free flame-retardant epoxy resin composition glue solution. Coat the glue solution on the PET release film through a coating machine, the thickness of the glue coating is 50 μm, and then heat it in an oven at 155 ° C for 5 minutes. The glue so...

Embodiment 2

[0043] Repeat the preparation of Example 1, the difference is that in the glue system of the halogen-free flame-retardant epoxy resin composition, 35 parts by weight of bisphenol A type epoxy resin (Epikote 1002) and 30 parts by weight of carboxyl-terminated nitrile rubber (Nipol1072CG) are used Parts, 13 parts by weight of phosphorus-containing epoxy resin (YEP-250), 22 parts by weight of phosphorus-containing phenolic resin (XZ92741), 10 parts by weight of nitrogen-based flame retardant (melapur MC15), aluminum hydroxide (average particle diameter is 1 to 5 μm, purity more than 99%) 30 parts by weight, 0.45 parts by weight of dicyandiamide and 0.1 part by weight of 2-ethyl-4-methylimidazole, and the preparation of other steps is the same as in Example 1.

Embodiment 3

[0045] Repeat the preparation of Example 1, the difference is that in the glue system of the halogen-free flame-retardant epoxy resin composition, adopt bisphenol A type NOVOLAC epoxy resin (EPR627, Hexion company manufactures) 19 parts by weight, bisphenol A type epoxy resin 25 parts by weight of resin (Epikote 1002), 30 parts by weight of carboxyl-terminated nitrile rubber (Nipol1072CG), 26 parts by weight of phosphorus-containing phenolic resin (XZ92741), 10 parts by weight of nitrogen-based flame retardant (melapur MC15), aluminum hydroxide (average 30 parts by weight of particle size (1 to 5 μm, purity above 99%), 0.75 parts by weight of dicyandiamide and 0.1 part by weight of 2-ethyl-4-methylimidazole, and the preparation of other steps is the same as in Example 1.

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Abstract

The invention relates to a halogen-free flame-retardant epoxy resin composition, and an adhesive film and a copper-clad plate prepared from same. The halogen-free flame-retardant epoxy resin composition comprises bisphenol A type epoxy resin, carboxylic group terminated butylnitrile rubber, phosphorus-containing resin, nitrogen flame retardants, amine curing agents, a curing accelerator, a fillerand an organic solvent. The adhesive film prepared from the halogen-free flame-retardant epoxy resin composition comprises a release film and the halogen-free flame-retardant epoxy resin composition coated on the release film. The copper-clad plate prepared from the halogen-free flame-retardant epoxy resin composition comprises a laminated sheet, an adhesive film clad on one side or two sides of the laminated sheet, and a copper foil pressed and clad on the adhesive film, wherein the laminated sheet comprises a plurality of glued bonding sheets; and the adhesive film comprises a release film and the halogen-free flame-retardant epoxy resin composition coated on the release film. The halogen-free flame-retardant epoxy resin composition has a high creepage tracking characteristic and good comprehensive performance such as flame retardancy and the like.

Description

technical field [0001] The invention relates to a resin composition, in particular to a halogen-free flame-retardant epoxy resin composition and an adhesive film and a copper-clad board made by using the composition. Background technique [0002] With the development of electronics in the direction of lightness, thinness, shortness and multi-function, printed circuit substrates, which are the main support of electronic components, are also becoming thinner, miniaturized and high-density; Higher requirements are put forward for the insulation reliability performance of the circuit board, especially under relatively harsh environmental conditions; at this time, when the surface of the insulating substrate of the circuit board is polluted by dust adhesion, moisture condensation or moisture erosion and ion pollutants, Under the action of an applied voltage, since the leakage current on the surface is much higher than that of a clean surface, the heat generated by the leakage cur...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/02C08L13/00C08L63/00C08L61/06C08K13/02C08K5/3492C08K3/22C08K3/30C09J163/02C09J113/00C09J163/00C09J161/06C09J7/02B32B15/08B32B15/20B32B27/08
Inventor 方克洪
Owner GUANGDONG SHENGYI SCI TECH
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