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High cti halogen-free epoxy resin composition for copper clad laminate and its application

A technology of halogen-free epoxy resin and halogen epoxy resin, applied in the direction of epoxy resin coating, application, synthetic resin layered products, etc., can solve the problems of poor heat resistance and poor heat resistance of FR4 boards, etc. achieve high heat resistance

Active Publication Date: 2017-05-03
ZHUHAI HONGCHANG ELECTRONICS MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Some high CTI materials in recent years are mainly CEM-3 materials, but since the implementation of lead-free in the electrical and electronic related industries, the high-temperature environment requirements for product applications have also been continuously improved, and new requirements have been placed on the heat resistance of materials. Therefore, , CEM-3 materials are somewhat unable to meet the above requirements, and some existing FR4 plates with high CTI also have the problem of poor heat resistance. This kind of plates are generally cured with dihydrogen amine. To improve the CTI, therefore, the heat resistance is not good

Method used

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  • High cti halogen-free epoxy resin composition for copper clad laminate and its application
  • High cti halogen-free epoxy resin composition for copper clad laminate and its application
  • High cti halogen-free epoxy resin composition for copper clad laminate and its application

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preparation example Construction

[0026] The main body of this resin is straight-chain phosphorus-containing epoxy resin, which has high CTI value, flame retardancy, good toughness and adhesion. The linear epoxy resin is selected from BPA type, BPF type or bisphenol S type linear epoxy resin; the reactive phosphorus compound is selected from one or a mixture of DOPO-HQ and DOPO-NQ. The synthesis method of the epoxy resin is: 1). Weigh each raw material according to the formula, and the formula contains the following raw materials in mass percentage: 55% to 75% of epoxy resin; 25% to 45% of reactive phosphorus-containing compound; wherein, the The epoxy resin is a linear epoxy resin; 2). Preparation of halogen-free phosphorus-containing epoxy resin: add the linear epoxy resin and the reactive phosphorus-containing compound in the reaction tank, heat up and dissolve, and dissolve at 110 ~ Add the catalyst at 130°C, then raise the temperature to 170-190°C, react for 2-4 hours, then lower the temperature and add a...

Embodiment 1

[0049] The composition (A1+7200HHH) of the present invention is used as the main resin, combined with curing agent DDM type benzoxazine and phenolic resin GERH833K65, and aluminum hydroxide is used as the filler. Use methyl ether (PM) or propylene glycol methyl ether acetate to adjust the varnish composition with a solid content of 55%, impregnate 7628 glass fiber cloth in the above varnish resin solution, and then dry it for several minutes in an impregnation machine at a temperature of 170-180°C. Control the drying time so that the melt viscosity of the dried prepreg is between 800 and 1800Pa.s, and finally put 8 pieces of film layer by layer between two pieces of 35μm thick copper foil, at 25Kg / cm 2 Pressure and temperature are controlled as follows:

[0050]

[0051] After hot pressing, a 1.6mm copper foil substrate can be obtained. The composition has a CTI of over 500V, a Tg of over 150°C, good heat resistance, and a V0 level of flame retardancy. The functions are d...

Embodiment 2

[0053] Repeating Example 1, changing the ratio of components A1 and 7200HHH, the CTI of the obtained composition is above 500V, the Tg is above 150°C, the heat resistance is good, and the flame retardancy reaches V0 level. The functions are detailed in Table 1.

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Abstract

The invention discloses a high-CTI halogen-free epoxy resin composition for copper-clad laminates and its application. The formula consists of the following components in parts by weight: 100-140 parts of halogen-free phosphorus-containing epoxy resin, dicyclopentan 10-35 parts of diene novolac epoxy resin, 32-60 parts of benzoxazine, 1-5 parts of phenolic resin, 0.05-0.5 parts of accelerator, and 25-70 parts of filler. The copper foil substrate prepared according to the present invention can meet the requirements of high CTI (CTI≧500V), high heat resistance (Tg≧150℃, PCT, 2h>6min), flame retardancy up to UL‑94V0 level, and is widely used in Electronic materials for electrical appliances, white goods, etc.

Description

technical field [0001] The invention belongs to the field of macromolecular materials, and specifically relates to a resin composition with high CTI, high heat resistance and other characteristics, which is suitable for circuit boards of electrical appliances, white household appliances and the like. Background technique [0002] With the rapid development of science and technology, the formation of large-scale industrial integration has caused irreparable damage to the living environment of human beings, so environmental protection has become very urgent. In recent years, with the rapid development of electronic technology, the impact of electronic products on the environment has become increasingly serious, especially electronic waste products. At present, most electronic products are halogen-based flame-retardant. After halogen-based combustion, not only the amount of smoke is large, but also the smell is unpleasant. , and will produce highly corrosive hydrogen halide gas...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L63/04C08L61/06C09D163/00C09D163/04C09D161/06C09D7/12C08K3/22B32B15/04B32B15/20B32B27/04B32B27/12B32B27/38C03C25/36C03C25/34
CPCC08L61/06B32B37/15C08G14/06C08L61/34H05K1/0326H05K1/0353B32B2038/168B32B2305/076B32B2305/18B32B2309/02B32B2311/12C08J2363/00C08J2363/10H05K2201/012H05K2201/0209C08G59/3218C08G59/38C08G59/504B32B2457/08C08G59/304C08G59/5046C08G59/56C08G59/621C08J5/043C08J5/10C08L2201/22C08L2205/02C08J5/244C08L63/04C08L63/06C08L63/00B32B37/06B32B37/10B32B37/12C08G59/063C08G59/686C08G59/688C08J2363/02C08J2363/08C08L2201/02C08L2203/20C08L2205/05H05K3/4611
Inventor 吴永光林仁宗宋黄明
Owner ZHUHAI HONGCHANG ELECTRONICS MATERIAL
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