A kind of halogen-free flame retardant super high cti high pressure resistant resin composition for copper clad laminate

Abstract

The invention discloses a halogen-free flame retardant ultrahigh CTI high voltage-withstanding resin composition for a copper-clad plate, which is prepared from, by weight, 25-55 parts of phosphorus-containing epoxy resin, 5-25 parts of novolac epoxy resin, 5-25 parts of phenol- aralkyl epoxy resin, 0.5-5.5 parts of amine solidifying agent, 0.05-1 part of accelerant, and 5-20 parts of boehmite. By means of the excellent properties of phenol- aralkyl epoxy resin, the composition is cooperated with phosphorus elements in the phosphorus-containing epoxy resin; a few amounts of boehmite filler with better heat resistance is introduced, and the composition is free from aluminium hydroxide; the copper-clad plate made by the composition has ultrahigh CTI (900V), high voltage withstanding property, flame retardancy, heat resistance, alkali resistance and other excellent comprehensive performances; besides, the copper-clad plate has good processing performance, and wide application prospect in the field of electronic products of a new energy automobile.

Description

technical field [0001] The invention relates to the technical field of copper-clad laminates, in particular to a halogen-free, flame-retardant, ultra-high CTI and high-voltage-resistant resin composition for copper-clad laminates. Background technique [0002] The "WEEE Directive" and "RoHS Directive" announced by the European Commission require that from July 1, 2006, the use of lead, mercury, cadmium, hexavalent chromium, and polybrominated diphenyl ethers will be prohibited in electronic and electrical equipment newly put on the market. and polybrominated biphenyls and other harmful substances. Halogen-free flame-retardant copper-clad laminates will not produce harmful substances to humans and the environment during processing, application, fire, and disposal, including recycling, burial, and incineration, which is conducive to environmental protection and global sustainable development. [0003] As electronic products tend to be lighter, thinner, and multi-functional, p...

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to overcome the need to add a large amount of aluminum hydroxide filler when making copper-clad laminates with ultra-high CTI values ​​(>900V) in the prior art, which easily reduces the processability of the board, heat resistance and alkali resistance. Deterioration; the addition of aluminum hydroxide is small, and the CTI and flame retardancy cannot meet the requirements. A halogen-free flame-retardant ultra-high CTI high-pressure resin composition for copper-clad laminates is provided.

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