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Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity

A technology with tracking index and high thermal conductivity, which is applied in printed circuit manufacturing, chemical instruments and methods, circuit lamination, etc., can solve the problem of light bending resistance, poor heat resistance and heat dissipation, poor machinability of aluminum substrates, and inability to Carry out hole metallization and other issues to achieve the effects of high CTI, good wettability, and high thermal conductivity

Inactive Publication Date: 2020-08-21
SHANDONG JINBAO ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, there are two types of thermally conductive copper clad laminates: aluminum substrate and composite base CEM-3 copper clad laminate. The aluminum substrate has poor machinability and is generally only used for single-sided panels. Temperature, heat resistance and heat dissipation are poor, and CTI is low

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0016] A method for preparing a high relative tracking index and high thermal conductivity FR4 copper-clad laminate, the steps of which are: mix 100 parts of alumina, 3.0 parts of coupling agent, and 200 parts of solvent evenly, start high-speed stirring for 2 hours, and carry out Pretreatment, to prepare A glue, mix 100 parts of epoxy resin, 20 parts of boron nitride, and 10 parts of silicon micropowder, and turn on the high-speed shearing and emulsifying device for 3 hours to prepare paste-like glue B glue; Mix glue A and glue B, stir evenly, add 20 parts of curing agent solution, 1.0 part of imidazole accelerator, mix evenly to prepare glue, coat the glue on electronic grade glass cloth, and heat it in an oven at 160°C Internally baked for 10 minutes to make a prepreg; take 3 prepregs and stack them together, each of which is covered with a piece of copper foil on both sides, hot press at a pressure of 2.5MPa and a temperature of 200°C for 150 minutes, and cool to make a cop...

Embodiment 2

[0018] A method for preparing a high relative tracking index and high thermal conductivity FR4 copper-clad laminate, the steps of which are: mix 200 parts of alumina, 5.0 parts of coupling agent, and 300 parts of solvent evenly, start high-speed stirring for 5 hours, and carry out Pretreatment, to prepare glue A, mix 300 parts of epoxy resin, 60 parts of boron nitride, and 50 parts of silicon micropowder, mix evenly, turn on the high-speed shearing and emulsification device for 3 hours, and make paste-like glue B; Mix glue with B glue, stir evenly, add 30 parts of curing agent solution, 1.2 parts of imidazole accelerator, mix evenly, and prepare glue solution, coat the glue solution on electronic grade glass cloth, and bake in an oven at 180°C Bake for 8 minutes to make a prepreg; take 5 prepregs and stack them together, and cover each side with a piece of copper foil, hot press for 120 minutes at a pressure of 2.8MPa and a temperature of 220°C, and cool to make a copper clad l...

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PUM

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Abstract

The invention discloses a preparation method of an FR4 copper-clad plate with high relative tracking index and high thermal conductivity. The preparation method comprises the following steps: weighing100-200 parts by weight of aluminum oxide, 3-5 parts by weight of a coupling agent and 200-300 parts by weight of a solvent, performing uniform mixing, and performing high-speed stirring for 2-3h soas to obtain a glue A; weighing 100-300 parts by weight of epoxy resin, 20-60 parts by weight of boron nitride and 10-50 parts by weight of silica powder, uniformly mixing, and treating for 2-3 hoursby adopting a shearing and emulsifying device to obtain a paste glue solution B; mixing the glue A and the glue B, uniformly stirring, adding 20-30 parts by weight of a curing agent solution and 0.8-1.2 parts by weight of an accelerant solution, uniformly stirring, coating electronic-grade glass cloth with the glue solution, and baking to obtain prepregs; stacking 3-5 prepregs together, laying copper foils on the two sides of the prepregs, and carrying out hot pressing to obtain the copper-clad plate. Targeted glue is prepared according to the characteristics of the FR4 copper-clad plate, theglue has good wettability on glass cloth, the prepared FR4 copper-clad plate has high CTI and high thermal conductivity, the CTI is larger than or equal to 600 V, and the thermal conductivity is larger than or equal to 1.5 W / m.K.

Description

technical field [0001] The invention relates to a copper-clad laminate, in particular to a preparation method of an FR4 copper-clad laminate with a high relative tracking index and high thermal conductivity. Background technique [0002] Copper clad laminate is an important material in the printed circuit board industry. With the development of electrical appliances, in order to improve the use of copper clad laminate in high humidity, high pollution, high voltage, high current, high heat and other environments, improve the heat dissipation capacity of heating electronic components It is of great significance to prolong its service life and improve the relative tracking index (CTI) and thermal conductivity of composite base copper clad laminates. [0003] At present, copper clad laminates mainly play an important role in LED lighting, automotive electronics, frequency converters, power supplies, etc. In the development process of LED, the problem of heat dissipation has alw...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B17/02B32B17/06B32B17/12B32B15/20B32B5/02B32B5/26B32B7/12B32B7/08B32B33/00B32B37/12B32B37/10B32B37/06B32B37/08H05K3/00C08L63/00C08K3/22C08K9/06C08K3/38C08K3/36
CPCB32B15/20B32B15/14B32B5/02B32B5/26B32B7/12B32B7/08B32B33/00B32B37/1284B32B37/10B32B37/06B32B37/08H05K3/0011C08K3/22C08K9/06C08K3/38C08K3/36B32B2037/1269B32B2262/101B32B2307/20B32B2307/302B32B2457/08H05K2203/06C08K2003/2227C08K2003/385
Inventor 秦伟峰陈长浩郑宝林付军亮杨永亮刘俊秀
Owner SHANDONG JINBAO ELECTRONICS
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