A kind of chlorine-free bromine-free high cti resin composition and application

Abstract

The invention belongs to the field of copper clad laminates, and in particular relates to a chlorine-free, bromine-free high CTI resin composition and its application. The resin composition of the present invention comprises 50-85 parts of epoxy resin in parts by weight, 10-45 parts of phosphorus-containing phenolic resin, 1-15 parts of amine curing agent, 0.01-1 part of curing accelerator, 10-100 parts Parts of filler, 0-20 parts of flame retardant, 1-50 parts of precipitated barium sulfate with an average particle size of 0.1-50 μm, 1-50 parts of polytetrafluoroethylene micropowder with an average particle size of 0.1-50 μm, 1-5 parts of dispersant , 0.1-2 parts of thixotropic additives and 80-100 parts of organic solvents. The copper clad laminate obtained from the resin composition obtained by the invention has the characteristics of good heat resistance, high CTI and good stability.

Description

technical field [0001] The invention relates to the field of copper clad laminates, in particular to a chlorine-free, bromine-free high CTI resin composition and its application. Background technique [0002] Traditional copper clad laminates (copper clad laminates) for printed circuits are mainly realized by adding brominated epoxy resin in order to improve the flame retardancy. However, in recent years, carcinogens such as dioxin and dibenzofuran have been detected in the combustion products of electronic and electrical equipment wastes containing halogens such as bromine and chlorine, and highly toxic substances may be released during the combustion process of halogen-containing products hydrogen halide. In addition, on July 1, 2006, two environmental directives of the European Union, the Directive on Waste Electrical and Electronic Equipment and the Directive on the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment, came into ...

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Problems solved by technology

However, due to the low initial decomposition temperature of aluminum hydroxide, and the decomposition releases small molecular gases, a large amount of addition has a significant negative effect on the heat resistance of copper clad laminates.

The heat resistance of boehmite is significantly improved compared with aluminum hydroxide, but its ability to improve the CTI of the epoxy resin system used in copper clad laminates is limited

The density of barium sulfate is very high and the particle size is small. When it is applied in the field of copper clad laminates, it has disadvantages such as difficulty in dispersion and easy settlement in the later stage, so there are many technical problems in its large-scale application.

[0006] Publication No. CN101942180B Chinese Invention Patent discloses that adding fluororesin can improve the water absorption, processability and CAF resistance of epoxy resin composite materials, but due to the low polarity and low surface tension of fluororesin, it is not compatible with epoxy resin Even if it is added in a small amount, it is easy to float and accumulate in the resin solution during the process of dipping and coating the resin solution into a prepreg, resulting in uneven dispersion in the finished prepreg or in the finished composite material, thus affecting the composite material. Uniformity of performance

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