Substrate-inspecting device having cleaning mechanism for tips of pins

Abstract

In a process in which a plurality of substrates are successively inspected, the tips of pins are cleaned without interrupting the flow of substrate inspection.  A substrate-inspecting device (10, 70) comprises a conveying means (22, 70) including a conveying path extending from a loading portion to an unloading portion, holders (40) for substrates to be inspected provided along the conveying path at predetermined intervals, and a moving means (22t) for moving the holders along the conveying path.  The substrate-inspecting device (10, 70) also comprises an inspecting section (30) that is provided at a position along the conveying path and successively inspects the substrates to be inspected held by the holders of the conveying means.  The inspecting section includes an inspecting jig (28).  The inspecting jig (28) has a plurality of pins.  The inspecting section (30) brings the pins into contact with inspection points in wiring on the substrates to be inspected and measures the electric characteristics of the wiring.  The substrate-inspecting device (10, 70) further comprises a cleaning means (50) provided between any adjacent holders from among the holders provided along the conveying path at the predetermined intervals.  The cleaning means (50) is moved by the moving means of the conveying means, and cleans the pins when the cleaning means passes through the inspecting section.

Description

technical field [0001] The present invention relates to a substrate inspection device for measuring the electrical characteristics of a wiring (or conductor pattern) of a substrate to be inspected by bringing a pin into contact with an inspection point of the wiring. In the substrate inspection device of the present invention, the cleaning mechanism of the tip end of the pin can clean the tip end of the pin without affecting the measurement of the electrical characteristics. Background technique [0002] In the substrate inspection device, an inspection jig embedded with multiple pins (also called "probes") is brought close to multiple inspection points of the wiring of the substrate to be inspected, and the electrical characteristics (such as resistance value) of the wiring are measured. The term "substrate to be inspected" used in this application document includes packaging substrates for semiconductor packaging, carrier films, printed wiring boards, flexible substrates, ...

AI Technical Summary

Problems solved by technology

In this way, when inspecting multiple boards, the board inspection is interrupted by the cleaning operation, so the total time until the inspection of all boards is completed becomes very long

In addition, there are problems caused by uneven cleaning level of the tip end of the pin due to manual work, and detachment and attachment of inspection jigs, etc.

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