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Led module

A technology of LED modules and LED chips, which is applied in the directions of electrical components, electric solid-state devices, circuits, etc., can solve the problems such as deviation of the LED module X circuit substrate.

Active Publication Date: 2013-04-03
ROHM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At this time, if the surface tension of the molten solder paste adhering to the mounting terminals 94A and 94B is unbalanced, there may be a problem that the LED module X deviates from the above-mentioned circuit board.

Method used

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Experimental program
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Embodiment Construction

[0028] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the drawings.

[0029] Figure 1 to Figure 4 An LED module according to the first embodiment of the present invention is shown. The LED module A1 of the present embodiment includes an LED chip 1 , a resin package 2 , a light-transmitting resin 3 , and a lead group 4 .

[0030] The LED chip 1 is the light source of the LED module A1. The LED chip 1 has a structure in which, for example, an n-type semiconductor layer mainly composed of GaN, an active layer, and a p-type semiconductor layer are stacked, and emits blue light. Electrodes (not shown) are formed on the upper surface of the LED chip 1 . The electrodes are connected to the lead group 4 through wires 51 . The LED chip 1 has, for example, a planar size of 0.2 to 0.3 mm square and a height of about 0.15 mm. In addition, the wavelength of light emitted from the LED chip 1 is determined by the material const...

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PUM

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Abstract

An LED module A1 includes an LED chip 1, a lead group 4 including a lead 4A on which the LED chip 1 is mounted and a lead 4B spaced apart from the lead 4A, a resin package 2 covering part of the lead group 4, and mounting terminals 41 and 42 provided by part of the lead group 4 that is exposed from the resin package 2 and spaced apart from each other in direction x. The LED module further includes a mounting terminal 43 spaced apart from the mounting terminal 41 in direction y, and a mounting terminal 44 spaced apart from the mounting terminal 42 in direction y. This arrangement allows the LED module A1 to be mounted at a correct position on a circuit board.

Description

technical field [0001] The invention relates to an LED module with LED chips as light source. Background technique [0002] Figure 13 It is a bottom view of an example of a conventional LED module (for example, refer patent document 1). The LED module X shown in the figure includes an LED chip 91, a resin package 92, and two leads 93A, 93B. The two leads 93A, 93B are arranged separately in the direction x, and a part of each is covered with the resin package 92 . The LED chip 91 is a light source of the LED module X, and is mounted on the lead 93A. The portion of the two lead wires 93A, 93B wound into the bottom surface side of the resin package 92 constitutes mounting terminals 94A, 94B for surface-mounting the LED module X. As shown in FIG. [0003] The surface mounting of the LED module X to, for example, a circuit board (not shown) is often performed using a reflow method. In this method, the solder paste is melted by raising the temperature in the reflow furnace wh...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00
CPCH01L33/62H01L2924/19107H01L25/167H01L2224/48247H01L2924/181H01L2224/48091H01L2924/00014H01L2924/00012H01L33/486H01L33/54H01L33/502
Inventor 峰下健太郎
Owner ROHM CO LTD