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Side emitting light emitting diode (LED) package structure

A technology of LED packaging and side lighting, which is used in electrical components, electrical solid-state devices, circuits, etc.

Inactive Publication Date: 2011-06-29
林谊
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in some applications, such as when the light-emitting end face of the LED and the plane of the PCB board need to be installed at an angle of 90°, the existing LED lights are difficult to meet such requirements

Method used

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  • Side emitting light emitting diode (LED) package structure
  • Side emitting light emitting diode (LED) package structure
  • Side emitting light emitting diode (LED) package structure

Examples

Experimental program
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Embodiment Construction

[0013] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0014] The symbols in the figure are uniformly described as follows: the package body 1, the bracket 2, the mounting seat 201 at one end of the bracket 2, the bracket 3, and the mounting seat 301 at one end of the bracket 3.

[0015] A side-emitting LED packaging structure. One end of the bracket 2 and the bracket 3 are electrically connected to the positive and negative poles of the LED light-emitting grains respectively, and are packaged in the package body 1. The bracket 2 is longer than the bracket 3. After bending, one end of the outer Extend to the outside of the package body 1 to form a mounting seat 201; the bracket 3 is relatively short, and one end is extended to the outside of the package body 1 to form a mounting seat 301. Three pairs of such brackets 2 and 3 are electrically connected to three LEDs of red, green and blue r...

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PUM

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Abstract

The invention discloses a side emitting light emitting diode (LED) package structure. The package structure comprise an LED chip, a package body and a plurality of brackets, wherein the plurality of brackets are electrically connected with the LED chip; and an emitting end face formed by the LED chip is perpendicular to a mounting end face formed by one end of each of the brackets. The LED package structure can be applied to an occasion on which the emitting end face of an LED is required to be perpendicular to the plane of a printed circuit board (PCB), so that the permeability of an LED display screen can be improved.

Description

technical field [0001] The invention relates to a package structure of an LED light emitting device. Background technique [0002] The LED display is a media tool with a wide range of applications. The LED lamp as a pixel unit contains a SMD (SMD) structure. The light-emitting end face of the existing SMD LED lamp and the mounting end face of the bracket are mutually In parallel, it is directly mounted on a flat PCB board during production. However, in some applications, such as when the light-emitting end surface of the LED and the plane of the PCB board need to be installed at an angle of 90°, the existing LED lamps are difficult to meet such requirements. Contents of the invention [0003] The invention provides a packaging structure in which the LED light-emitting end surface and the mounting end surface of the bracket are perpendicular to each other, so as to meet the application requirement that the LED light-emitting end surface and the PCB board form a vertical an...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62
Inventor 林谊
Owner 林谊
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