Testing and ageing adapter for semiconductor laser

Abstract

The invention discloses a testing and ageing adapter for a semiconductor laser, which comprises an adapter base, an adapter electrode, the semiconductor laser, a spring pressure head, an adapter upper cover and an upper cover fastening bolt, wherein the semiconductor laser is placed in the middle of the adapter base; the semiconductor laser is fixed and compacted by using the adapter electrode and the spring pressure head thereon; and the adapter upper cover provides a mechanical protection effect for the adapter base, the adapter electrode, the semiconductor laser and the spring pressure head, and simultaneously provides a compression platform for testing and ageing of the semiconductor laser to ensure uniform cooling of the adapter base. The invention discloses the testing and ageing screening adapter for the semiconductor laser Chip on Submount (CoS). The adapter provides a reliable and effective testing assessment tool for multiple required properties such as power consistency, wavelength consistency, thermal resistance consistency and the like when a plurality of chips are integrated and encapsulated. Based on the design, corresponding testing parameters are provided, and the feasibility of the design is verified.

Description

technical field [0001] The invention relates to a quality evaluation device of a semiconductor laser device Chip on Submount (CoS). Background technique [0002] High-power semiconductor lasers are often packaged in bar-chip, that is, multi-tube parallel packaging. Such packaging will inevitably result in high operating currents, which in turn will increase the requirements for the current-carrying capacity of the power supply circuit. Multi-tube series semiconductor laser chip packaging is a new type of semiconductor laser packaging technology that has emerged in recent years. There is no doubt that this technology is an effective way to greatly reduce the laser operating current. [0003] However, affected by many factors such as chip consistency and packaging consistency, the individually packaged laser monomers will have a certain degree of performance fluctuations, such as output power, wavelength, thermal resistance, and so on. These performance fluctuations will affe...

AI Technical Summary

Problems solved by technology

[0003] However, due to the influence of many factors such as chip consistency and package consistency, the individual packaged laser monomers will have a certain degree of performance fluctuations, such as output power, wavelength, thermal resistance, etc.

These performance fluctuations will affect the overall performance of multi-chip integrated packaging, in other words, it may reduce yield, reduce service life and increase return rate

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