Leveling gauge

A spirit level and leveling technology, which is applied in the field of spirit levels, can solve problems such as complex structure, high price, and poor efficiency of spirit levels, and achieve the effect of simple structure, cheap structure, and high-efficiency adjustment

Inactive Publication Date: 2011-07-27
DISCO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, with conventional levels, it is necessary to perform level adjustment of the processing equipment while visually confirming that the air bubbles of the level have reached the center, and at least two workers are required to perform leveling (leveling out) of the processing equipment, resulting in poor efficiency. The problem
[0009] Moreover, although the level disclosed in Patent Document 1 is configured to sound a buzzer when a level is detected, there is a problem that the structure of the level is complicated and expensive.

Method used

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Embodiment Construction

[0022] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. figure 1 The appearance of the cutting device 2 to which the spirit level of the present invention can be applied at the time of installation is shown, and the cutting device 2 is capable of dicing a semiconductor wafer and dividing it into individual chips (devices).

[0023] On the front surface side of the cutting device 2, an operation member 4 is provided for the operator to input instructions to the device such as machining conditions. A display member 6 such as a CRT (Cathode Ray Tube) for displaying a guide screen for the operator or an image captured by an imaging member described later is provided on the upper part of the apparatus.

[0024] The wafer W is attached to a dicing tape T which is an adhesive tape, and the outer peripheral edge portion of the dicing tape T is attached to the ring-shaped frame F. As shown in FIG. Thereby, the w...

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Abstract

The invention provides a leveling gauge, which can be operated by one worker and has a simple structure and a low cost. The leveling gauge comprises a window forming a curved plane where liquids and bubbles are sealed. Through the window, the position of the bubbles can be ensured by the eyes. Thus the leveling can be ensured. The leveling gauge is characterized in that the leveling gauge comprises a luminous element equipped above the center of the window forming a curved plane, a light receiving element for receiving the light sent from the luminous element and reflected at the interface between the bubbles and the liquids, and an acoustical generator for sound generation when the light receiving element receives the reflected light.

Description

technical field [0001] The present invention relates to a spirit level for precisely measuring the inclination of a processing apparatus that performs precise processing of wafers, for example, in a semiconductor workshop. Background technique [0002] A semiconductor wafer has a large number of devices such as IC (integrated circuit: integrated circuit), LSI (large-scale integration: large-scale integrated circuit), etc. formed on the surface, and each device is divided by predetermined dividing lines (spacers), and the use of grinding After grinding the back surface of the semiconductor wafer by a grinding device to process the semiconductor wafer to a predetermined thickness, the semiconductor wafer is divided into individual devices by cutting the line to be divided by a dicing device, and the divided devices are used in mobile phones. Machines, personal computers and other electrical equipment. [0003] The grinding device or the dicing device includes at least a chuck...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01C9/24G01J1/42
Inventor 纪祐司
Owner DISCO CORP
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