Resin sealing metal mold device

Abstract

The invention provides a resin seal device for metal dies which is convenient for cleaning, and high in production efficiency and qualified rate. The resin seal device comprises a resin storage part (23) communicated with an inner cavity (21) through a communicating path (24). The inner cavity (21) is arranged on a lower die of upper and lower dies to be resin sealed through substrate holder with a semiconductor installed on the surface thereof, and the resin storage part (23) is arranged on an up-down movable conveying pin (26). In particular, in the resin storage part (23), the conveying pin (26) is arranged at a position of which the distant to the communicating path (24) makes it impossible that the seal resin directly pushed out by the conveying pin (26) passes through the communicating path (24).

Description

technical field [0001] The present invention relates to a resin-sealed metal mold device, in particular to a resin-sealed metal mold device for resin-sealing electronic components such as semiconductor elements mounted on a substrate with a liquid sealing resin material at normal temperature. Background technique [0002] In the past, as a resin-sealed metal mold device, there was a molding method for sealing. In this molding method, a substrate mounted with one or more semiconductor devices is resin-sealed with an upper mold and a lower mold, and the lower mold There is an up and down movable mechanism on the top, and one or more spare inner cavities (refer to Patent Document 1). [0003] That is, this resin sealing metal mold device performs resin sealing on a substrate by keeping the amount of sealing resin in the inner cavity constant at all times by heating the upper mold and the lower mold. the step of supplying more than the necessary amount of sealing resin to the c...

AI Technical Summary

Problems solved by technology

[0005] However, the resin-encapsulated metal mold device (refer to figure 1 , figure 2 ) uses a highly fluid sealing resin material that is liquid at room temperature. Therefore, during resin molding, the sealing resin material is likely to infiltrate into the gap between the vertical movable mechanism 5 and the lower mold 2, and solidification is likely to occur. Resin residue

Moreover, even if the metal mold is cleaned every time the molding operation is completed, it is not easy to completely remove the resin residue, and the work efficiency is low.

Therefore, once the vertical movable mechanism 5 is moved in the subsequent resin molding process, the residual resin slag will enter the inner cavity and cause defective products, resulting in a low product qualification rate.

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