Contact sensor packaging structure and manufacture method thereof

Abstract

The invention provides a contact sensor packaging structure. The contact sensor packaging structure comprises a substrate, a first conductive layer disposed on the substrate and a plurality of second conductive layers disposed on the substrate. The substrate has a first groove and a second groove, wherein the first groove and the second groove are respectively defined by a bottom face and an inner side wall. The first conductive layer extends to the outer side wall of the substrate from the bottom face of the first groove along the inner side wall and via an opposite direction; and the second conductive layer is divided into a first conductive part and a second conductive part which are mutually isolated. The first conductive part is disposed at the centre of the bottom face of the second groove; and the second conductive part extends to the outer side wall of the substrate from the bottom face of the second groove along the inner side wall.

Description

technical field [0001] The present invention relates to a proximity sensor packaging structure and a manufacturing method thereof, in particular to a proximity sensor packaging structure in which a sensing chip and a light-emitting chip are packaged together and a manufacturing method thereof. Background technique [0002] Infrared (infrared, IR) proximity sensors have been gradually applied to mobile phones and palm-sized devices. For example, infrared proximity sensors can be used to control the on / off of a display screen in a digital camera device. When an object such as human eyes approaches the viewing window on one side of the infrared proximity sensor, the infrared proximity sensor will detect the object and turn off the display screen, thereby saving the power consumption of the display screen. [0003] Please refer to figure 1 , figure 1 It is a schematic diagram of an assembly structure of an existing proximity sensor. like figure 1 As shown, the existing assem...

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Problems solved by technology

[0004] However, since the light emitted by the infrared light-emitting diode chip is divergent, and the transparent cover has partial reflection characteristics, when the light generated by the infrared light-emitting diode chip passes through the transparent cover, part of the light will be reflected by the transparent cover and be sensed. The detection chip receives it, causing the light reflected by the object to be detected and the light reflected by the transparent cover to interfere with each other, resulting in a wrong judgment by the sensing chip

Moreover, in order to prevent the light of the infrared light emitting diode chip from being detected by the sensing chip before it exits the assembly structure, the distance between the infrared light emitting diode chip and the sensing chip of the existing proximity sensor needs to be as far away as possible, but it increases the existing The volume of the assembled structure of the proximity sensor

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