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Iron powder tin-based composite soldering alloy ball and flip chip bumping method thereof

A technology of alloy ball and ball planting, which is applied in the direction of welding medium, welding equipment, metal processing equipment, etc.

Inactive Publication Date: 2013-03-20
王宣胜
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the ball planting method of ultra-small solder balls, how to overcome the influence of moisture absorption and electrostatic force on the surface of the solder balls, and accurately control the solder balls to the correct position will face great challenges. At present, there is no relevant technology that is effective enough the completion of

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  • Iron powder tin-based composite soldering alloy ball and flip chip bumping method thereof

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Embodiment Construction

[0009] The present invention will be further described below in conjunction with the examples. It should be understood that these examples are only for the purpose of illustration, and in no way limit the protection scope of the present invention.

[0010] The present invention mainly includes two stages of technical features, one is to mix iron powder into solder alloy balls to form a combined structure of composite solder alloy balls to improve the bonding strength between circuit boards and electronic components; It is used in flip-chip ball planting technology, and it also has the effect of simplifying the process.

[0011] Regarding the manufacturing method of iron powder tin-based composite solder alloy balls, since the solubility and diffusion ability of iron in solder are extremely low, there is no concern about coarsening. According to literature, the addition of iron can effectively improve the normal temperature tensile strength of solder Strength, especially in the...

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Abstract

The invention provides an iron powder tin-based composite soldering alloy ball and a flip chip bumping method thereof. The method mainly comprises the following steps of: adding extremely small iron metal particles into the soldering alloy ball to manufacture the soldering alloy ball comprising iron powder; effectively attracting the whole composite soldering alloy ball via magnetic equipment, sothat in the flip chip bumping process, the ultra-small soldering alloy ball is effectively assisted to be located to be firmly attracted and filled in a bumping steel plate hole; and providing an appropriate ball removing technology to remove the excessive soldering alloy ball, so the clustering phenomenon caused by the surface moisture adsorption and electrostatic effect of the ultra-small soldering alloy ball can be prevented, and the bumping technology can be smoothly completed to enhance the combination of a miniature circuit substrate and an electronic component.

Description

technical field [0001] The invention relates to an iron-powder-tin-based composite solder alloy ball and a flip-chip planting method thereof, which is mainly a technique for flip-chip construction, wherein the solder alloy ball containing iron powder is planted on a circuit substrate, For the most efficient welding function. Background technique [0002] In recent years, electronic packaging technology has been impacted by the continuous improvement of upstream chip design and manufacturing capabilities, and the output of high-density, high-I / O, high-speed and high-power related electronic components; Thin, short, and small ardent demands, under attack from both sides, force the practitioners of electronic packaging to continuously innovate and develop new technologies to reduce volume, increase yield, improve heat dissipation, reduce costs, and enhance reliability, etc., to meet the requirements of Market demand. For high-density packaging, the flip-chip method has become...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
CPCH01L2224/11005H01L2924/01327H01L2924/01006H01L24/742H01L2224/11334H01L2924/014
Inventor 王宣胜
Owner 王宣胜
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