Supercharge Your Innovation With Domain-Expert AI Agents!

Temperature testing device

A technology for testing devices and temperature sensors, which is applied in measuring devices, radiation pyrometry, optical radiation measurement, etc., can solve the problems of heavy workload, poor contact, complicated connection, etc., to improve work efficiency, fast and efficient Sensing effect

Inactive Publication Date: 2011-09-28
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
View PDF3 Cites 13 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method is complicated to connect, requires a lot of work, and is prone to poor contact or disconnection

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Temperature testing device
  • Temperature testing device
  • Temperature testing device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0027] The present invention will be further described in detail below in conjunction with the accompanying drawings.

[0028] see figure 1 and figure 2 , is a temperature testing device 1 provided in an embodiment of the present invention, which is used to test the temperature of multiple electronic components 400 fixed on the same circuit board 300 . The temperature testing device 1 includes a fixed frame 10 , two guide rails 20 , a sliding rail 30 , a temperature sensor 40 , a driving device 50 and a processor 70 .

[0029] The circuit board 300 is substantially rectangular, and includes a connection surface 310 , and the plurality of electronic components 400 are all fixed on the connection surface 310 .

[0030] The fixed frame 10 is a rectangular frame including four frame sides 11 . The fixing frame 10 is disposed on one side of the connection surface 310 for fixing the circuit board 300 .

[0031] The two guide rails 20 are arranged in parallel on two opposite fra...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

A temperature testing device, used for sensing temperatures of a plurality of electronic components on one circuit board, comprises a fixing frame, two guide rails, a slide rail, a temperature sensor, a drive unit and a processor. The fixing frame is used for fixing the circuit board. The two guide rails are parallelly arranged on the fixing frame. The slide rail is slidingly arranged on the two guide rails. The temperature sensor is vertically and slidingly arranged on the slide rail so as to sense the temperatures of a plurality of electronic components on the circuit board. The drive unit is used for driving the slide rail to move along the guide rails and driving the temperature sensor to move along the slide rail. The processor, which is electrically connected with the temperature sensor and the drive unit, is used for recording the positions of the electronic components and controlling the drive unit according to the positions. Under the control of the drive unit and the processor, the temperature sensor can be rapidly moved to each of the electronic components to sense temperatures. Therefore, the temperature of each electronic component can be rapidly and efficiently sensed.

Description

technical field [0001] The invention relates to a testing device, in particular to a temperature sensing device for testing the temperature of each electronic component on a circuit board. Background technique [0002] At present, the temperature of each electronic component on the computer motherboard needs to be tested at the initial stage of design. The current temperature test adopts the method of connecting thermocouple resistance wires to each electronic component separately. Since the resistance value of thermocouple resistance wires changes with the change of temperature, it can be known by the change of resistance value of thermocouple resistance wires. The temperature of each electronic component. However, this method is complicated to connect, has a large workload, and is prone to poor contact or disconnection. Contents of the invention [0003] In view of this, it is necessary to provide a temperature testing device capable of rapidly and efficiently sensing ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G01J5/00
CPCG01J5/047G01J5/0096G01J5/026
Inventor 童松林
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More