Heat-radiating device combination and electronic device employing same

A technology of heat sink and radiator, applied to circuits, electrical components, electrical solid devices, etc., can solve problems such as circuit short circuit, increase production cost, burn electronic components, etc., achieve simple and firm assembly, reduce assembly cost, and reduce material cost Effect

Inactive Publication Date: 2011-09-28
FURUI PRECISE COMPONENT (KUNSHAN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such clasps usually need to be manually assembled with specific tools, thus increasing production costs
And when the cooling device is in use, when the buckle is not tightly connected and falls off, it may cause a short circuit and burn the electronic components, thus affecting the working performance of the electronic components

Method used

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  • Heat-radiating device combination and electronic device employing same
  • Heat-radiating device combination and electronic device employing same
  • Heat-radiating device combination and electronic device employing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] see figure 1 and figure 2 , which is a cross-sectional view of an electronic device 100 according to the first embodiment of the present invention. The electronic device 100 includes a heat sink assembly 110 and an electronic component 120 . The heat sink assembly 110 is attached to the electronic component 120 for dissipating heat from the electronic component 120 .

[0038] The heat sink assembly 110 includes a heat sink 10 and a plurality of spring screw fasteners 20 .

[0039] The heat sink 10 includes a base 12 and a plurality of cooling fins 14 disposed on the base 12 . These cooling fins 14 are arranged in parallel and at intervals. In this embodiment, the base 12 is a square heat conducting plate. A plurality of spaced first through holes 122 are formed on the base 12 , and an inner wall of each first through hole 122 is tapped with an internal thread 124 . Each first through hole 122 is used for matching with a corresponding spring screw fastener 20 .

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PUM

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Abstract

The invention relates to a heat-radiating device combination, which comprises a radiator and at least one spring screw turnbuckle, wherein at least one through hole is arranged on the radiator and is used for allowing the at least one spring screw turnbuckle to penetrate through; the spring screw turnbuckle comprises a screw turnbuckle and a spring sleeved on the screw turnbuckle; the screw turnbuckle comprises a propping part and a body extending from the propping part; anti-slip threads are formed on the body, internal threads matched with the anti-slip threads are arranged on the inner wall of the through hole; and the anti-slip threads of the body and the internal threads of the through hole are screwed in and are propped against and clamped at the lower side of the radiator after penetrating through the through hole. In the invention, the screw turnbuckle is prevented from separating from the radiator through the arrangement of the anti-slip threads on the body of the screw turnbuckle, the assembly is simple, convenient and firm, and the material and assembly costs are reduced. The invention further relates to an electronic device employing the radiating device combination.

Description

technical field [0001] The invention relates to a heat dissipation device, in particular to a heat dissipation device combination for cooling electronic components and an electronic device using the heat dissipation device combination. Background technique [0002] With the rapid development of the computer industry, more and more heat is generated by heat-generating electronic components such as micro-processing chips. Electronic components dissipate heat. This kind of heat sink is fixed on the circuit board by means of a fixing fastener such as a spring screw with a threaded end provided with the circuit board and threadedly engaged with the circuit board. Before the radiator is used, the spring screw is usually preset in the through hole of the radiator. During transportation, in order to prevent the spring screw from falling off from the radiator due to vibration and other reasons, a clasp with a diameter larger than the through hole of the radiator is usually clamped ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20H01L23/40G06F1/20
CPCG06F1/20H01L23/4006H01L2924/0002H01L2924/00
Inventor 谢宜莳
Owner FURUI PRECISE COMPONENT (KUNSHAN) CO LTD
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