High-power heat-dissipation module
A heat dissipation module and high-power technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problem of insufficient heat dissipation efficiency of non-fan heat dissipation modules, and achieve good heat dissipation effect
Inactive Publication Date: 2011-11-02
ZHONGSHAN WEIQIANG TECH
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Problems solved by technology
[0003] In order to solve the problem of insufficient cooling efficiency of non-fan cooling modules, the present invention provides a high-efficiency cooling module
Method used
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[0034] A high-power heat dissipation module provided by the present invention can be used to dissipate heat from a heating element 3 , and its structure includes a heat exchange element 1 and a non-fin type heat dissipation module 2 .
[0035] Such as figure 1 , Figure 5 , Figure 6 ,and Figure 7 Figure 9 , Figure 10 , the heat exchange element 1 has a flat part 11 for placing the heating element 3, and a fixing structure 12 is provided on the rear side of the flat part 11 for installation and fixing, such as image 3 and Figure 8 As shown, the heat exchange element 1 has a closed inner cavity 101, which is filled with working fluid, and a powder sintered part 102 is attached to the wall of the inner cavity 101, and as image 3 As shown, a support structure 103 supporting the overall strength can also be provided in the inner cavity 101. The working fluid inside the heat exchange element 1 has a liquid-gas two-phase change function, so it is equivalent to a supercon...
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The invention relates to a high-power heat-dissipation module for radiating heating elements. The high-power heat-dissipation module comprises a heat exchange element and a non-fin heat-dissipation module. A closed inner cavity is arranged in the heat exchange element and is internally provided with a powder sintering part and a working solution, and a flat part of the heating element and a fixing structure are arranged outside the heat exchange element. The non-fin heat-dissipation module comprises a central hole part and at least one air channel, wherein the central hole part is provided with the fixing structure, and the at least one air channel is arranged around the central hole part. Heat generated by the heating element is transferred from the heat exchange element to the non-fin heat-dissipation module, and airflow can generate in the air channel through a chimney effect, thus the heat generated by the heating element is dissipated quickly. Compared with a traditional heat-dissipation module, the high-power heat-dissipation module disclosed by the invention can be directly applied to more than 100W heating elements under the condition of not using a fan, thus the high-power heat-dissipation module is particularly suitable for the heat dissipation of high-power heating elements.
Description
technical field [0001] The invention relates to a cooling module, in particular to a high-power cooling module for cooling electronic components such as LEDs, CPUs, GPUs, chipsets, power semiconductors, circuit boards or multi-chip packages. Background technique [0002] The industry uses heat dissipation modules to dissipate heat from electronic components. At present, the most basic heat dissipation module is a fin structure designed based on the principle of heat conduction. The heat dissipation module is in contact with the electronic components to receive the heat emitted by the electronic components when they are working. , the heat is transferred to the fin group, and the heat is dissipated into the air by the fin group. The area and number of fins in contact with the air affect the heat dissipation efficiency of the heat dissipation module. However, limited by the problems of the existing technology, this most basic heat dissipation module structure can only realize ...
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IPC IPC(8): H01L23/367H01L23/427H01L25/00
Inventor 李克勤陈宏杰钟蜀龙
Owner ZHONGSHAN WEIQIANG TECH