High-power heat-dissipation module
A heat dissipation module and high-power technology, applied in electrical components, electric solid state devices, circuits, etc., can solve the problem of insufficient heat dissipation efficiency of non-fan heat dissipation modules, and achieve good heat dissipation effect.
Inactive Publication Date: 2013-11-27
ZHONGSHAN WEIQIANG TECH CO LTD
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Problems solved by technology
[0003] In order to solve the problem of insufficient cooling efficiency of non-fan cooling modules, the present invention provides a high-efficiency cooling module
Method used
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[0034] The high-power heat dissipation module provided by the present invention can be used for heat dissipation of the heating element 3 , and the structure includes a heat exchange element 1 and a non-fin type heat dissipation module 2 .
[0035] like figure 1 , Figure 5 , Image 6 ,and Figure 7 Figure 9 , Figure 10 , the heat exchange element 1 is provided with a flat portion 11 for placing the heating element 3, and a fixing structure 12 is provided on the rear side of the flat portion 11 for installation and fixing, such as image 3 and Figure 8 As shown, the heat exchange element 1 has a closed inner cavity 101, the inner cavity 101 is filled with a working fluid, and a powder sintering part 102 is attached to the wall of the inner cavity 101, and as shown in the figure image 3 As shown, a support structure 103 for supporting the overall strength can also be provided in the inner cavity 101. The working fluid inside the heat exchange element 1 has a liquid-ga...
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The invention relates to a high-power heat-dissipation module for radiating heating elements. The high-power heat-dissipation module comprises a heat exchange element and a non-fin heat-dissipation module. A closed inner cavity is arranged in the heat exchange element and is internally provided with a powder sintering part and a working solution, and a flat part of the heating element and a fixing structure are arranged outside the heat exchange element. The non-fin heat-dissipation module comprises a central hole part and at least one air channel, wherein the central hole part is provided with the fixing structure, and the at least one air channel is arranged around the central hole part. Heat generated by the heating element is transferred from the heat exchange element to the non-fin heat-dissipation module, and airflow can generate in the air channel through a chimney effect, thus the heat generated by the heating element is dissipated quickly. Compared with a traditional heat-dissipation module, the high-power heat-dissipation module disclosed by the invention can be directly applied to more than 100W heating elements under the condition of not using a fan, thus the high-power heat-dissipation module is particularly suitable for the heat dissipation of high-power heating elements.
Description
technical field [0001] The invention relates to a heat dissipation module, in particular to a high-power heat dissipation module for heat dissipation of electronic components such as LEDs, CPUs, GPUs, chip sets, power semiconductors, circuit boards or multi-chip packages. Background technique [0002] The industry uses heat dissipation modules to dissipate heat from electronic components. At present, the most basic heat dissipation modules are designed based on the principle of heat conduction. , transfer the heat to the fin group, and the fin group dissipates the heat into the air. The area and number of fins in contact with the air affect the heat dissipation efficiency of the heat dissipation module. However, due to the problems of the prior art, this most basic heat dissipation module structure can only achieve heat dissipation of electronic components with a power of about 100W. For higher power electronic components, the heat dissipation module needs to add fans or ot...
Claims
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IPC IPC(8): H01L23/367H01L23/427H01L25/00
Inventor 李克勤陈宏杰钟蜀龙
Owner ZHONGSHAN WEIQIANG TECH CO LTD