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Device for ejecting droplets of a fluid having a high temperature

A fluid droplet and fluid technology, which is applied in the direction of tin feeding device, inking device, electrical component assembly printed circuit, etc., can solve problems such as inability of injection device, non-wetting of fluid cavity wall, melting of glaze, etc.

Active Publication Date: 2014-08-13
佳能生产型打印荷兰公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This seal is suitable for printing solder with a relatively low melting point, for printing metals such as gold, silver and copper, etc., glass is not suitable because its melting point is the same size, which will cause the melting of the glaze, so that The fluid chamber walls are not wettable and thus the spraying device cannot operate as described above

Method used

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  • Device for ejecting droplets of a fluid having a high temperature
  • Device for ejecting droplets of a fluid having a high temperature
  • Device for ejecting droplets of a fluid having a high temperature

Examples

Experimental program
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Embodiment Construction

[0033] In the figures, the same reference numerals refer to the same elements. figure 1 Shown is a part of a spraying device 1 for spraying droplets of a relatively hot fluid, in particular molten metals such as copper, silver and gold, among others. The spraying device 1 comprises a support frame 2 made of a heat-resistant material, preferably a heat-conducting material. As described below, the support frame 2 is cooled by a cooling liquid. Good thermal conductivity increases the distribution of heat through the support frame 2 and thus increases the spreading of heat. Furthermore, the support frame 2 is preferably configured to absorb only a relatively small amount of heat from any heated parts of the spraying device 1 . For example, the support frame 2 may be made of aluminum and polished such that the aluminum reflects a relatively large amount, eg 95% or even more, of heat radiation from any hot part of the spraying device 1 .

[0034] The spraying device 1 is provided...

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PUM

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Abstract

In an ejection device for ejecting droplets of a relatively hot fluid, the fluid chamber body is made of a heat resistant material and the inner surface of the fluid chamber body is wettable by the fluid, the inner surface defining the fluid chamber of the ejection device. This arrangement is such that no additional force needs to be applied to force the fluid into the bore, ie the narrow tubing is directed into the nozzle.

Description

technical field [0001] The present invention relates to a device for ejecting droplets of a fluid having a high temperature, such as a molten metal or a molten semiconductor. Background technique [0002] It is known from US 5377961 that molten metal (eg solder) can be ejected into relatively small droplets using a force known as the Lorentz force. When placed in a magnetic field, the Lorentz force results from an electric current flowing through the metal. Obtain the direction and magnitude of the force as a function of the cross product of the current and magnetic field vectors: . [0003] However, the device disclosed in US 5377961 is only described for ejecting solder droplets, which have a relatively low melting point (approximately 500 K). For ejecting metal droplets (eg, gold, silver, copper and titanium, etc.) with relatively high melting points (eg, above about 1200 K), the device needs to be specifically configured to be able to operate at such high temperature...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/08C23C4/12H05K3/34B23K3/06B41J2/035
CPCB41J2202/04H05K3/10B23K3/0638B22F9/082B23K2201/40H05K2203/128B23K3/0607B22F2009/0836B22F2009/088B23K2101/40B22F9/08B23K3/06C23C4/12C23C10/00C23C10/08C23C10/18C23C10/20C23C10/22C23C10/42C23C10/52H05K3/34
Inventor M.V.拉萨R.伯克豪特W.P.J.克拉森斯H.C.M.范格努克滕E.V.库茨内索夫
Owner 佳能生产型打印荷兰公司