Method for performing chemically mechanical polishing by using chemically mechanical polishing equipment

Abstract

The invention discloses a method for performing chemically mechanical polishing by using chemically mechanical polishing equipment. The chemically mechanical polishing equipment comprises a plurality of chemically mechanical polishing machines, a manipulator, and transition devices, wherein the plurality of chemically mechanical polishing machines and the transition devices are arranged around the manipulator. The method comprises the following steps of: A) conveying wafers on the transition devices to at least more than one of the plurality of chemically mechanical polishing machines by the manipulator so as to polish the wafers by using the plurality of chemically mechanical polishing machines; B) conveying the polished wafers by using the manipulator to the transition devices; and C) repeating the steps A) and B) until the polishing of all wafers is finished. The method for performing chemically mechanical polishing by using the chemically mechanical polishing equipment has the advantages of short wafer transmission distance, and wafer transmission time and high working efficiency.

Description

technical field [0001] The invention relates to a method for chemical mechanical polishing using chemical mechanical polishing equipment. Background technique [0002] In the production process of large-scale integrated circuits, the requirements for the flatness of wafers are very high. At present, wafer planarization is achieved by using a chemical mechanical polishing (CMP) process, and a chemical mechanical polishing machine is the main equipment for completing the chemical mechanical polishing process. Existing polishing equipment adopts a turntable structure with four polishing heads and three polishing discs or a linear structure with a single disc and a single head. [0003] In the turntable structure with four polishing heads and three polishing discs, the turntable supports the rotation of four polishing heads and works between different stations. The turntable is heavy, complex in structure, requires high precision, difficult to manufacture, and high in cost, an...

AI Technical Summary

Problems solved by technology

However, the polishing equipment with single-disc and single-head linear structure has low production efficiency, large transmission distance between wafers, and long transmission time

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