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computer case

A shell and computer technology, applied in electrical digital data processing, digital processing power distribution, instruments, etc., can solve problems such as speeding up thermal convection and inability to carry heat away from radiators

Inactive Publication Date: 2011-12-14
HONG FU JIN PRECISION IND (SHENZHEN) CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The processing capacity of electronic components such as CPU (Central Processing Unit) is continuously upgraded, and the cooling devices used for heat dissipation are also diversified. The commonly used cooling device is composed of a radiator and a fan. One of the surfaces of the radiator is connected to the electronic components. Contact, the other surface forms a number of cooling fins with a certain distance, air flow channels are formed between the cooling fins, and the fan is located on the side that communicates with the air flow channel of the radiator, thereby accelerating its heat convection speed, but often due to computer There are many components in the chassis, even if there is a fan to dissipate heat for the CPU radiator, the airflow flowing through the radiator is too small to effectively remove the heat from the radiator

Method used

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Embodiment Construction

[0011] See figure 1 An embodiment of the computer casing of the present invention includes a casing 20, a computer motherboard 30, a heat sink 40, and a fan 50.

[0012] The casing 20 includes a bottom plate 21 and a rear plate 22 vertically arranged on an edge of the bottom plate 21. The main plate 30 is fixed on the bottom plate 21, and a heating element (not shown) is installed on the main plate 30. In this embodiment, the heating element is a central processing unit. In other embodiments, the heating element may also be other elements; the rear plate 22 is provided with a plurality of ventilation holes 223 at positions opposite to the heating element.

[0013] The radiator 40 includes a base 41. A number of parallel radiating fins 43 are fixed on the base 41. These radiating fins 43 are perpendicular to the rear plate 22. A gap is provided between the two radiating fins 43 to allow air to flow through. The heat pipes 45 are fixed on the radiators 40, one end of each heat pipe 4...

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PUM

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Abstract

A kind of computer shell, comprises a base plate and a rear plate that is arranged on an edge place of described base plate, a main board is fixed on described base plate, and described main board is provided with a heating element, and a radiator and described heating element In contact with each other, the rear plate is provided with a number of ventilation holes at the position opposite to the heat sink, a fan is fixed between the heat sink and the rear plate, and the air inlet surface of the fan faces the heat sink device, the air outlet surface of the fan faces the ventilation hole.

Description

Technical field [0001] The invention relates to a computer casing, in particular to a computer casing with good heat dissipation performance. Background technique [0002] Due to the rapid upgrading of the electronics industry, many high-precision electronic components have been developed. With the development of computer technology, the speed of these electronic components is increasing, and the heat generated by them also increases. The processing capacity of electronic components such as CPU (central processing unit) is constantly upgraded, and the heat dissipation devices used for heat dissipation are also diversified. The heat dissipation device generally used is a combination of a radiator and a fan, and one of the surfaces of the radiator is connected to the electronic components. Contact, the other surface forms a number of heat sinks with a certain distance between them, air flow channels are formed between the heat sinks, and the fan is located on the side communicating...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/18G06F1/20
CPCG06F1/20
Inventor 孙洪智陈琛李阳
Owner HONG FU JIN PRECISION IND (SHENZHEN) CO LTD
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