Unlock instant, AI-driven research and patent intelligence for your innovation.

Flaw detecting system and method

A defect detection and defect technology, applied in the use of sound waves/ultrasonic waves/infrasonic waves to analyze solids, ultrasonic waves/sonic waves/infrasonic waves, etc., can solve problems such as damage to the substrate to be tested, increase user burden, and inability to provide accurate test results. , to achieve the effect of increasing the burden

Active Publication Date: 2013-09-04
IND TECH RES INST
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the detection technology disclosed in the above-mentioned background technology excites the acoustic wave signal by directly hitting the substrate to be tested, which often causes damage to the substrate to be tested due to factors such as improper operation.
Furthermore, the above detection method must also be matched with a database with pre-stored spectrograms of standard acoustic signals, which will also increase the burden on users
In addition, since the above detection method only analyzes the spectrogram of the acoustic signal in the frequency domain, it still cannot provide detection results with high accuracy.
[0005] As for the detection technology disclosed in U.S. Publication No. 4,603,584, because it is still limited to the analysis of the spectrogram of the acoustic signal in the frequency domain, it still cannot provide detection results with high accuracy.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Flaw detecting system and method
  • Flaw detecting system and method
  • Flaw detecting system and method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0037] The technical content of the present invention is described below through specific specific embodiments, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific examples, and various modifications and changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0038] Please also see Figure 1A , Figure 1B , Figure 1C , Figure 1D , Figure 1E , which shows the basic structure diagram of the defect detection system of the present invention. As shown in the figure, the defect detection system 1 includes a fixing device 10, a micro-vibration excitation device 11, an extraction device 12, an isolation device 13, an analysis and detection device 14, and Display device 15.

[0039...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a flaw detecting system for detecting a crystal silicon product and a method for detecting the crystal silicon product. The method comprises the steps of: slightly vibrating a fixed crystal silicon product by a microvibration exciter, so that the crystal silicon product generates an exciting signal; capturing the exciting signal by a capturing device, so that an analyzing detector is used for analyzing the exciting signal captured by the capturing device by a special analysis method in a time frequency way to obtain an analysis result; and detecting the flaw state of the crystal silicon product according to the analysis result.

Description

technical field [0001] The present invention relates to a defect detection system and method, more specifically, to a defect detection system and method for detecting fragmentation defects of crystal silicon products by using time-frequency analysis method. Background technique [0002] In the manufacturing process inspection process of crystalline silicon products such as solar panels, the most important thing is to quickly and correctly detect products with fragmentation defects and eliminate them, so as to maintain the yield and reliability of products. Chipping defects are divided into external chipping defects that can be recognized by the naked eye and internal chipping defects that cannot be recognized by the naked eye. The focus of the inspection process is often how to detect products with internal chipping defects in real time. [0003] As disclosed in China Taiwan Publication Patent No. M350015, it is a photoelectric element detection device, which can detect phot...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): G01N29/04G01N29/34
Inventor 苏瑞尧钟裕亮王俊杰吴建峰刘彦辰
Owner IND TECH RES INST
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More