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Manufacturing method of resin sealed semiconductor device, resin sealed semiconductor device, and lead frame used for semiconductor device

A technology of resin sealing and manufacturing methods, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as dimensional tolerance, cutting danger, and inability to separate tie rods 830

Inactive Publication Date: 2012-04-18
SHINDENGEN ELECTRIC MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0022]However, if the tie bar 830 is positioned close to the resin-sealed semiconductor device main body 910, when the tie bar 830 is separated from the outer pins 821 to 824 , even if the punching die P is arranged with high precision, since there is a tolerance in the size of each resin-sealed semiconductor device 900 to be cut, there is an upper edge Pa of the punching die P (refer to Figure 13) touches the resin-sealed semiconductor device body 910, and puts the resin-sealed semiconductor device body 910 part of the danger of resection
To prevent this from happening, if the punching die P is positioned downward (Y' direction in FIG. 13) is lowered so that the upper end Pa of the punching die P does not contact the resin-sealed semiconductor device main body 910, and incomplete cutting will occur near the upper end 830a of the tie bar 830. , and the problem that it is impossible to separate the tie rod 830 from the outer pins 821-824

Method used

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  • Manufacturing method of resin sealed semiconductor device, resin sealed semiconductor device, and lead frame used for semiconductor device
  • Manufacturing method of resin sealed semiconductor device, resin sealed semiconductor device, and lead frame used for semiconductor device
  • Manufacturing method of resin sealed semiconductor device, resin sealed semiconductor device, and lead frame used for semiconductor device

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Embodiment approach 1

[0061] figure 1 It is an explanatory diagram showing the structure of the lead frame 100 according to the first embodiment. in addition, figure 1 The illustrated lead frame 100 is a lead frame corresponding to one resin-sealed type semiconductor device.

[0062] Such as figure 1 As shown, the lead frame 100 of Embodiment 1 has: a semiconductor element mounting portion 110, a plurality (4) of external pins (first external pins 121, 122 and second external pins) as terminals connected to the outside 123, 124), which are arranged to connect the wires of the first outer pins 121, 122 and the second outer pins 123, 124, and serve as tie rods of the resin sealing part to prevent the resin from flowing out in the resin sealing engineering 130, and an auxiliary bar 140 for maintaining the rigidity of the lead frame 100, which is provided to connect the tips of the first outer pins 121, 122 and the second outer pins 123, 124. In addition, the tie bar 130 and the auxiliary bar 140 ...

Embodiment approach 2

[0100] Figure 9 It is a schematic configuration diagram showing a resin-sealed semiconductor device 202 according to the second embodiment. Figure 9 (a) is a front view showing a state where the resin-sealed semiconductor device 202 according to the second embodiment is mounted on the substrate 600, Figure 9 (b) is a side view showing a state in which the resin-sealed semiconductor device 202 according to the second embodiment is mounted on the substrate 600 . in, Figure 9 A part shown in (b) is a cross section. In addition, in Figure 9 In (b), let the left side of a figure be a front side, and the right side of a figure will be a back side.

[0101] In addition, the resin-sealed semiconductor device 202 of Embodiment 2 has the same structure as the resin-sealed semiconductor device 200 of Embodiment 1 except for the external shape of the resin-sealed semiconductor device main body 210 . The manufacturing method of the resin-sealed semiconductor device of Embodiment ...

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Abstract

The target of the invention is to provide a manufacturing method of a resin sealed semiconductor device, the resin sealed semiconductor device, and a lead frame used for a semiconductor device. Compared with a conventional resin sealed semiconductor device, the installing height of the resin sealed semiconductor device to a base plate is lower. In the lead frame, corners of connecting parts of a plurality of outer feet to a tie bar are provided with groove parts C1 and C2. The groove part C1 uses a punching hole die to separate the tie bar. A side end edge on one side of the punching hole die is in the outer feet and is arranged in the groove part C1, and the side end edge on the other side is on the outside of the outer feet. An upper end edge on the main body side of the resin sealed semiconductor device is arranged in the groove part C1, and a lower end edge on one side opposite to the main body side of the resin sealed semiconductor device is lower than the lower end edge. The groove part C2 uses the same method to separate the tie bar.

Description

technical field [0001] The present invention relates to a method of manufacturing a resin-sealed semiconductor device, a resin-sealed semiconductor device, and a lead frame for the resin-sealed semiconductor device. Background technique [0002] A resin-sealed semiconductor device formed by sealing a semiconductor element and a semiconductor element mounting portion such as a die pad on which the semiconductor element is mounted with resin (see, for example, Non-Patent Document 1) is widely used in various electronic devices. . [0003] Figure 11 It is a perspective view showing the external structure of a resin-sealed semiconductor device 900 disclosed in Non-Patent Document 1. FIG. because Figure 11 It is a diagram showing the external structure, so the semiconductor elements etc. existing inside are not shown. in addition, Figure 11 The illustrated resin-sealed semiconductor device 900 (referring to the conventional resin-sealed semiconductor device 900 ) is a single...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L23/495
CPCH01L2924/0002H01L2924/00
Inventor 玉手登志幸
Owner SHINDENGEN ELECTRIC MFG CO LTD