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Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip

A technology of circuit pattern and sputtering process, applied in circuits, semiconductor/solid-state device manufacturing, electrical components, etc., can solve the problems of complex process and many steps, and achieve the effect of reducing etching steps, shortening process flow, and reducing process difficulty

Active Publication Date: 2015-07-22
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Through the above method, the original pads that require RDL on the four sides of the chip can be transferred to the middle of the chip. However, the above RDL method has many steps and the process is complicated.

Method used

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  • Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip
  • Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip
  • Method of manufacturing circuit pattern through sputtering technology and rewiring method of chip

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Embodiment 1

[0028] Please refer to figure 1 , an embodiment of the present invention provides a method for making a circuit pattern through a sputtering process, including:

[0029] 201. A jig is set between the component to be sputtered and the cathode of the sputtering equipment, and a through groove of a predetermined shape is opened on the jig.

[0030] The existing sputtering method is generally to sputter the entire surface of the components to be sputtered, such as circuit boards or chips, that is, place the components in the sputtering chamber of the sputtering equipment, start the sputtering equipment, The atoms sputtered by the cathode of the sputtering equipment act on the entire surface of the component without any shielding, forming a layer of sputtering layer on the entire surface of the component. Subsequently, etching and other methods are used to remove the sputtered layer in unnecessary parts, and only retain the sputtered layer in required parts, thereby forming a circ...

Embodiment 2

[0039] Please refer to Figure 4 , an embodiment of the present invention provides a chip rewiring method, including:

[0040] 301. Set a photoresist on the surface of the chip, where the photoresist covers areas on the chip other than original pads.

[0041] like Figure 5a As shown, a layer of photoresist 460 can be completely coated on the surface of the chip 440, and then, through exposure and development processes, the photoresist 460 on the original pads 450 that need RDL on the chip is removed, so that these original pads 450 exposed, while other parts on the chip 440 are still covered by the photoresist 460 .

[0042] 302. Use the method described in Embodiment 1 to sputter the chip to form a required circuit pattern.

[0043] like Figure 5b As shown, in this step, the method for making circuit patterns by the sputtering process described in Embodiment 1 is used to sputter the chip 440, and the chip 440 is directly sputtered on the surface of the chip 440 by openi...

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Abstract

The invention discloses a method of manufacturing a circuit pattern through a sputtering technology and a rewiring method of a chip; the method of manufacturing the circuit pattern through the sputtering technology comprises the following steps of: arranging a jig between a component to be sputtered and a cathode of sputtering equipment, and arranging a through groove with a set shape on the jig; starting the sputtering equipment, leading atoms sputtered by the cathode to pass through the through groove and then be adhered on the surface of the component, and forming the circuit pattern. According to the technical scheme of the embodiment, the circuit pattern with the set shape can be directly manufactured by sputtering; and compared with the traditional technical scheme of firstly sputtering a whole surface and then etching the circuit pattern, the technical scheme has the advantages that an etching step is omitted, a technological process is shortened and the technology difficulty is reduced.

Description

technical field [0001] The invention relates to the technical field of circuit board production, in particular to a method for producing circuit patterns through a sputtering process and a chip rewiring method. Background technique [0002] Integrated circuit (Integrated Circuit, IC) chips have a tendency to develop towards high density and multi-function. At present, the thinnest circuit on the chip has reached 28nm. While the line density is increasing, the input / output port (input / output, I / O) density of the chip is also increasing, and the commonly used four-sided array outlet method on the chip has been difficult to meet the requirements. [0003] Therefore, a re-distribution (retry design line, RDL) process of converting quadrilateral array pads into area array pads appears. Using the RDL process, the array pads on the four sides of the chip can be converted into the surface array pads in the middle of the chip, and the size and spacing of the pads can be increased t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/768
Inventor 丁鲲鹏张建超孔令文彭勤卫
Owner SHENNAN CIRCUITS
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