Substrate inspection control method and device

Abstract

The present invention provides a substrate inspection control method and device for determining inspection items of an inspection device based on device configuration change information from a component mounting device. The substrate inspection control device includes: a device configuration change information acquisition unit (43) for acquiring device configuration change information of a component mounting device (12); an inspection item determination unit (44) for Information, to determine the inspection items of the inspection device (13) used to inspect the circuit board (S); the inspection item instruction unit (45), based on the inspection items determined by the inspection item determination unit, instructs the use of the inspection device to inspect the circuit board. Check item.

Description

technical field [0001] The present invention relates to a board inspection control method and device capable of determining inspection items of an inspection device based on device configuration change information from a component mounting device. Background technique [0002] Conventionally, inspection devices such as those described in Patent Document 1 and Patent Document 2 are known as devices for inspecting whether electronic components are correctly mounted on a circuit board. [0003] In the content described in Patent Document 1, a substrate inspection device is installed after the reflow oven for soldering the components mounted on the mounter 3, and when parts are replaced or replenished in the feeder, the substrate inspection device specifies the substrate to be inspected. and parts, check the installation for errors. [0004] On the other hand, in the content described in Patent Document 2, a mounting inspection machine 20 for inspecting the mounted state of ele...

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Problems solved by technology

[0007] In the content described in Patent Document 1, the substrate inspection device installed after the reflow oven checks whether there is a mounting error. Therefore, at the stage when the mounting error is judged, the substrate with the mounting error has already passed through the reflow oven. , there is a problem that it is necessary to melt the solder of the substrate judged to have a mounting error to peel off the part or replace it with a new part, which requires extremely complicated work

[0008] On the other hand, in the content described in Patent Document 2, based on the inspection reference data corresponding to the component mounting machine, the state of the mounted component is inspected by the mounting inspection machine to detect a mounting defect, and then determine the component mounting process for mounting the component. The suction nozzle of the component mounting machine is used to instruct the suction nozzle of the component mounting machine to correct the mounting failure, so there is a problem that, in order to perform the required inspection within the tact time of the component mounting machine, as the mounting inspection machine needs Expensive visual inspection machine capable of high-speed and high-precision inspection

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