Heat radiation device of multiple XFP (10 Gigabit Small Form Factor Pluggable) optimal modules on single board of communication equipment

Abstract

The invention discloses a heat radiation device of multiple XFP (10 Gigabit Small Form Factor Pluggable) optimal modules on a single board of communication equipment. The heat radiation device comprises a heat radiator body and flaky heat radiation boards which are arranged in one-to-one correspondence to a plurality of shielding cages for plug-in mounting of the XFP optical modules, wherein the flaky heat radiation boards are arranged below the heat radiator body, and one side edge of each flaky heat radiation board is respectively connected with the heat radiator body respectively through arc-shaped flexible heat conduction fins. According to the invention, because the flaky heat radiation boards arranged in one-to-one correspondence to the plurality of XFP optical modules are respectively connected with the heat radiator body through the arc-shaped flexible heat conduction fins, structure design and assembly difficulties that the plurality of XFP optical modules share the heat radiator are effectively solved by utilizing high heat conduction performance and better flexibility and bendability of the arc-shaped flexible heat conduction fins, therefore the purpose that heat generated by each XFP optical module can be effectively transferred to the heat radiator from optical module shells and is then discharged to the environment under the action of cold air through the heat radiator is ensured.

Description

technical field [0001] The invention relates to a communication device, in particular to a heat dissipation device for multiple XFP optical modules on a single board of a communication device. Background technique [0002] With the development of communication technology, the thermal power consumption of a single communication device is increasing, so the heat dissipation problem of communication equipment is becoming more and more severe. In particular, the heat dissipation of the XFP optical module has become one of the bottlenecks restricting the heat dissipation of the entire communication equipment. The specific performance is as follows: (1) In the line board of optical transmission equipment, a single board usually contains 2 channels, 4 channels, or even 8 channels of XFP optical modules. With the development of technology, the current power consumption level of XFP optical modules It is also increasing sharply. The power consumption of a single XFP optical module h...

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Problems solved by technology

(2) The XFP optical module usually needs to have good hot-swappability, so the XFP optical module cannot reduce the heat transfer resistance by filling the soft heat-conducting material between the device and the heat sink. In practical applications, it usually shows There is line contact or point contact between the XFP optical module and the radiator, which seriously affects the heat dissipation performance of the XFP optical module

However, due to the limited compressibility of the thermal pad, when eight XFP optical modules share a heat sink, the pluggability of the XFP optical modules is difficult to meet the requirements, and it cannot be guaranteed that each XFP optical module has a suitable plugging force. At the same time, it is difficult to fully guarantee the heat dissipation reliability of each XFP optical module

[0006] To sum up, none of the existing technologies can well solve the problem of ensuring good heat dissipation and pluggability of multiple XFP optical modules in the limited space of the single board of the communication equipment

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